Keithley Instruments, Inc.

Mesatronic

Mesatronic S.a.

Vincent Reynaud

William Knauer

Andre Belmont

Eric Saint-Etienne

William Daniau

A spatial transformer includes an insulating substrate; a plurality of test terminal assemblies on the substrate; and a plurality of contact surfaces on the transformer, each providing an interconnection point for electrical connection between a respective test terminal assembly and a device under test. Each test terminal assembly has a center conductor trace on an upper substrate surface; a lower substrate guard trace beneath the center conductor trace; and a pair of upper substrate guard traces adjacent to opposite sides of the center conductor trace, the guard traces being electrically interconnected. The guard traces in combination with the center conductor trace provide a desired characteristic impedance for an RF signal applied therebetween or a guarded DC connection for a DC signal applied to the center conductor trace and a DC guard applied to the guard traces.

Spatial transformer for RF and low current interconnect

The invention relates to a process for manufacturing a card with multiple tips, designed in particular for testing semiconductor chips or integrated circuits before encapsulation thereof and comprising an oxidised silicon substrate,on the two opposite surfaces, one of the surfaces being provided with conducting strips connected to contacts in the form of tips,. A thin metal layer,is deposited by vapour deposition in a vacuum or by cathode sputtering on one of the insulated surfaces of the monolithic substrate,, and the conducting strips are obtained by means of a UV photolithography operation making use of a photosensitive resin, followed by etching of the thin metal layer,according to the location and shape of the tips,. Another UV photolithography operation is then performed consisting in depositing a thick layer,of photosensitive resin on the thin etched layer, the resin then being revealed with the drawing,of the tips. The tips,are finally obtained by electroforming by means of a bath containing metal ions enabling electroformed pads corresponding to the shape of the drawings,to be achieved.

Method for making cards with multiple contact tips for testing semiconductor chips

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Grenoble, France

Vincent Reynaud