Rogers Corporation

World Properties, Inc.

Vincent R Landi

Bruce B Fitts

Michael E St Lawrence

Murali Sethumadhavan

Doris I Hand

J Mark Mersereau

Walter A Robbins

Raymond R Miskiavitch

Samuel Gazit

Robert H Walker

Bruce G Kosa

Luis D Borges

Saroj Kumar Roy

Edwin R Rowlands

David E Manso

Elana E Haveles

Jeffrey L Dalton

An electrical circuit material having a conductive layer disposed a substrate, wherein the substrate comprises an organic or inorganic polymer comprising a covalently bound polyhedral silsesquioxane (POSS). The substrate may further comprise an additional dispersed POSS, any other fillers including fibrous webs. Use of covalently bound POSS allows for flame retardancy in compositions having acceptable dielectric constants and dissipation factors.

Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof

An electrical circuit material having a conductive layer disposed a substrate, wherein the substrate is formed from a thermosetting composition comprising a polybutadiene or polyisoprene resin; an optional, functionalized liquid polybutadiene or polyisoprene resin; an optional butadiene- or isoprene-containing copolymer; an optional low molecular weight polymer; an optional curing agent; a cross-linking agent; a particulate fluoropolymer; and about 20 to about 50 percent by weight, based on the total weight of the thermosetting composition, of a magnesium hydroxide having a low ionic content. Use of magnesium hydroxide allows the composition to attain a high level of flame retardancy without use of halogenated flame retardants, while maintaining good moisture absorption and other physical properties.

Circuit substrate material, circuits comprising the same, and method of manufacture thereof

A conductive, moldable composite material for the manufacture of electrochemical cell components comprising a thermosetting resin system and conductive filler wherein the thermosetting resin composition comprises: (1) a polybutadiene or polyisoprene resin; (2) an optional functionalized liquid polybutadiene or polyisoprene resin; (3) an optional butadiene- or isoprene-containing copolymer; and (4) an optional low molecular weight polymer. In a preferred embodiment, the conductive moldable composite material is used to form a bipolar plate, current collector or other electrochemical cell component. Articles made of the conductive moldable composite material are resistant to chemical attack and hydrolysis, have excellent mechanical strength and toughness, have a volume resistivity of about 0.116 ohm-cm or less and preferably about 0.04 ohm-cm or less and a thermal conductivity of at least about 5 watts/meter &deg; K.

Thermosetting composition for electrochemical cell components and methods of making thereof

Articles are formed from a thermosetting composition based on polybutadiene or polyisoprene resins which are subjected to a high temperature cure step of greater than 250&deg; C. The thermosetting compositions may include fillers such as particulate ceramic fillers and may also include woven webs for improved dimensional stability and decreased brittleness. The formation process of this invention is particularly well suited for making electrical circuit substrates for microwave and digital circuits, typically in the form of the thermosetting composition being laminated on one or both opposed surfaces to metal conductive foil (e.g., copper).

Method of manufacture of polybutadiene and polyisoprene based thermosetting compositions

Articles are formed from a thermosetting composition based on polybutadiene or polyisoprene resins which are subjected to a high temperature cure step of greater than 250&deg; C. The thermosetting compositions may include fillers such as particulate ceramic fillers and may also include woven webs for improved dimensional stability and decreased brittleness. The formation process of this invention is particularly well suited for making electrical circuit substrates for microwave and digital circuits, typically in the form of the thermosetting composition being laminated on one or both opposed surfaces to metal conductive foil (e.g., copper). The compositions find particular utility for encapsulating and electrically insulating electrical resistance heating elements for use with fluids.

Heating elements comprising polybutadiene and polyisoprene based thermosetting compositions

An electrical substrate material is presented comprising a resin matrix which includes a thermosetting polybutadiene or polyisoprene resin, an ethylene propylene rubber, and optionally a thermoplastic unsaturated butadiene- or isoprene-containing polymer; a particulate filler, a flame retardant additive, a curing agent, and a woven or unwoven fabric. The presence of the ethylene propylene rubber enhances the heat age properties of the substrate material, particularly the dielectric strength and the mechanical properties, while other electrical, chemical, and mechanical properties of the material are not adversely effected.

Polybutadiene and polyisoprene based thermosetting compositions and method of manufacture

An electrical substrate material is presented comprising a thermosetting matrix which includes a polybutadiene or polyisoprene resin, an unsaturated butadiene- or isoprene-containing polymer and an ethylene propylene rubber; a particulate filler and, a fabric. Preferred ethylene propylene rubbers are ethylene propylene copolymers and ethylene propylene diene terpolymer rubbers wherein the diene is dicyclopentadiene. The ethylene propylene rubber is present in an amount of up to about 20 wt % with respect to the resin, preferably in an amount of about 1 to about 7 wt %, more preferably about 5 wt %. The presence of the ethylene propylene rubber enhances the dielectric strength of the resulting electrical substrate material, while other electrical, chemical, and mechanical properties of the material are not adversely effected.

Polybutadiene and polyisoprene based thermosetting compositions and

An electrical substrate material is presented comprising a thermosetting matrix of polybutadiene or polyisoprene and a co-curable second resin distinct from the first resin. A peroxide cure initiator and/or crosslinking agent may optionally be added. The presence of a very high surface area particulate filler, preferably fumed silica, is also preferred, in that its presence results in a prepreg which has very little tackiness and can therefore be easily handled by operators. This low tackiness feature allows for the use of conventional automated layup processing, including foil cladding, using one or more known roll laminators. While the prepreg of this invention is tack-free enough to be handled relatively easily by hand, it is also tacky enough to be tacked to itself using a roll laminator (e.g., nip roller) at room temperature. The composition of this invention is particularly well suited for making electrical circuit substrates for microwave and digital circuits, typically in the form of the thermosetting composition being laminated onto one or both opposed surfaces to a metal conductive foil such as copper.

Polybutadiene and polyisoprene thermosetting compositions and method of

An electrical substrate material is presented which comprises a thermosetting matrix which includes a polybutadiene or polyisoprene resin and an unsaturated butadiene or isoprene containing polymer in an amount of 25 to 50 vol. %; a woven glass fabric in an amount of 10 to 40 vol. %; a particulate, preferably ceramic filler in an amount of from 5 to 60 vol. %; a flame retardant and a peroxide cure initiator. A preferred composition has 18% woven glass, 41% particulate filler and 30% thermosetting matrix. The foregoing component ratios and particularly the relatively high range of particulate filler is an important feature of this invention in that this filled composite material leads to a prepreg which has very little tackiness and can therefore be easily handled by operators. This low tackiness feature allows for the use of conventional automated layup processing, including foil cladding, using one or more known roll laminators. While the prepreg of this invention is tack-free enough to be handled relatively easily by hand, it is also tacky enough to be tacked to itself using a roll laminator (e.g., nip roller) at room temperature. In addition, another important feature of this invention is the low amount of glass fabric filler relative to the higher range of particulate filler which leads to improved (lower) CTE in the Z axis or thickness direction, improved electrical performance (e.g., dissipation factor), lower cost and the ability to tailor dielectric constant through appropriate selection of particulate fillers.

A forming process for producing a hard shaped molded article that includes subjecting a moldable thermosetting composition to a high temperature cure condition at a temperature greater than about 250.degree. C. and less than the decomposition temperature of the composition to form a crosslinked polymeric network. In particular, the invention features a forming process for producing a hard shaped molded article that includes the steps of

Process for forming hard shaped molded article of a cross-linked liquid

A highly accurate circuit pattern in intimate contiguous relationship with a curved plastic body and a method of manufacture thereof. In accordance with the present invention, circuit pattern is detachably fixed to a flexible substrate and is placed into a mold. A molding compound is then forced into the mold pressing the circuit against the mold wall and filling all of the mold voids. The molded product is thereafter removed from the mold. The flexible substrate, on which the metallic circuit is printed, is removed from the molded product leaving the metallic circuit imbedded into the molded product.

Method of making a curved plastic body with circuit pattern

A phenolic compound having improved retention of useful properties over long periods of time at elevated temperatures is presented. The novel phenolic compound, preferably a glass reinforced phenol-formaldehyde with mineral fillers has incorporated therein elastomers which primarily undergo crosslinking on oxidative aging, such as butadiene based rubbers, and/or molecular sulfur or sulfur donor components. These additives unexpectedly retard thermal degradation with time of aging and provide exceptionally good retention of weight, molded dimensions and mechanical properties.

Heat stable phenolic composition containing aramid fibers

Heat stable phenolic composition

A solderless connector especially suited for interconnecting a flexible circuit to another circuit or component, either rigid or flexible, is presented. The solderless connector of the present invention utilizes the pressure mating of contact areas with the added advantage of a wiping or cleaning action on the contacting surfaces. In one embodiment of the present invention, this wiping action is achieved by bending or crimping the two layers adjacent to the contact areas, thereby causing them to have mutual relative sliding motion over each other as they are being pressed into contact therebetween. In another embodiment, the bending or crimping of the flexible circuit layers is accomplished in the structure of the solderless connector itself.

Solderless connector technique

A solderless connection method and apparatus is presented wherein means are provided to either gradate or minimize the change in impedance between the contact portions of circuits which are to be connected therein. In a first embodiment of the present invention, a solderless electrical connector is provided in which impedance is gradated between the two different characteristic impedances of the circuits which are to be connected. The procedure for carrying out such a gradual change in impedance is the change in dielectric constant caused by compression of a shaped cellular polymeric material. In a second embodiment, a solderless electrical connection is provided which applies even pressure across the circuit element, but which also has a low dielectric constant. Such a connector includes syntactic foam produced by adding hollow microspheres, such as glass or silica microspheres, to an elastomer.

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Danielson, CT, United States of America

Vincent R Landi