Rockwell Collins, Inc.

Vincent P Marzen

James D Sampica

Paul R Nemeth

Tracy J Barnidge

Albert N Stuppi

Gary D Bishop

Michael R Jones

Birendra Bahadur

The present invention is a process for performing a planarization treatment of pressure-sensitive adhesive (PSA). The process includes positioning a first substrate onto a support surface of a planarization tool. The process further includes placing at least one layer of PSA onto the first substrate. The process further includes positioning a second substrate onto the layer(s) of PSA. The process further includes applying a pressure to the second substrate via a flexible membrane, said pressure being applied in a generally uniform, unidirectional and localized manner. Further, the applied pressure flattens the PSA between the first substrate and the second substrate for promoting suitability of the PSA for use in rigid-to-rigid lamination processes.

Planarization treatment of pressure sensitive adhesive for rigid-to-rigid substrate lamination

The present disclosure is directed to a substrate lamination system and method. A substrate lamination apparatus may comprise: (a) a vacuum chamber; (b) a flexible membrane; and (c) a substrate support. A system for laminating substrates may comprise: (a) a vacuum chamber; (b) a flexible membrane; (c) a substrate support; (d) a vacuum pump; (e) a compressor; and (f) a control unit, wherein the control unit is configured to carry out the steps: (i) evacuating the vacuum chamber; and (ii) applying pressure to at least one of a first substrate and a second substrate.

Substrate lamination system and method

The present invention is a process for performing rigid-to-rigid substrate lamination implementing pressure-sensitive adhesive (PSA). The process may include pressurizing a first sealed cavity to a first pressure. The process may further include creating a vacuum within a second sealed cavity, the second sealed cavity being sealed from the first sealed cavity by a flexible membrane. The process may further include applying the first pressure to a laminate assembly stack via the flexible membrane, the laminate assembly stack including a first substrate, a second substrate, and a PSA layer, the PSA layer being positioned between the first substrate and the second substrate. The process may further include applying the vacuum created within the second sealed cavity to the laminate assembly stack. The applied first pressure and the applied vacuum promote intimate contact between the first substrate and the second substrate of the laminate assembly stack via the PSA layer.

System and method for completing lamination of rigid-to-rigid substrate by the controlled application of pressure

The present disclosure is directed to a substrate lamination system and method. A method for laminating substrates may comprise: (a) disposing a pressure-sensitive adhesive later between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate; (b) disposing the first substrate, pressure-sensitive adhesive layer and second substrate within a vacuum chamber; (c) evacuating the vacuum chamber; (d) applying pressure to at least one of the first substrate and the second substrate. A system for laminating substrates may comprise: (a) means for disposing a pressure-sensitive adhesive layer between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate; (b) means for disposing the first substrate, pressure-sensitive adhesive layer and second substrate within a vacuum chamber; (c) means for evacuating the vacuum chamber; (d) means for applying pressure to at least one of the first and second substrates.

System and method for completing lamination of rigid-to-rigid substrates by the controlled application of pressure

An apparatus for separating a laminated substrate assembly comprises at least a substantially planar assembly, a cutting member housing assembly positioned on a first side of the substantially planar assembly, a cutting member receiving assembly positioned on a second side of the substantially planar assembly, substantially opposite from the first side of the planar assembly suitable for receiving an amount of the elongated cutting member. At least one of the cutting member housing assembly or the cutting member receiving assembly is configured to provide an amount of tension to the elongated cutting member as the elongated cutting member is released by the cutting member housing assembly or received by the cutting member receiving assembly, and the elongated cutting member is configured to remove an amount of adhesive from an adhesive layer of the laminated substrate assembly.

System and method for disassembling laminated substrates

A method for alignment comprises calculating the proper alignment position for a plurality of planar items based on at least one datum per planar item of the plurality of planar items, instructing a tooling system to form a tooling aid for providing the proper alignment position in a planar substrate lamination apparatus, and inserting the tooling aid into the planar substrate lamination apparatus for the proper alignment of the plurality of planar items in the planar substrate lamination apparatus.

Alignment system and method thereof

A touch screen for LCDs which uses a plurality of shockwave detectors disposed around the periphery of the viewing area to detect the location of a touch or tap which is the point of origin of an expanding shockwave.

Method and apparatus for data entry for a liquid crystal display

A method of sealing an Organic Light-Emitting Diode (OLED) assembly is disclosed. A dry film adhesive is applied to a capping layer. An OLED assembly is placed in a cavity of a fixture. The capping layer is positioned in the cavity of the fixture such that a first edge of the capping layer contacts the OLED assembly and a second edge of the capping layer is separate from the OLED assembly. Atmospheric pressure is reduced between the capping layer and the OLED assembly. The second edge of the capping layer is dropped such that the second edge of the capping layer is adjacent the OLED assembly.

Process for glass-to-glass sealing OLEDs with dry film adhesive

A method of attaching a protective cover to an Organic Light-Emitting Diode (OLED) assembly is disclosed. According to the method, a liquid adhesive is applied to a substantial portion of a face one of the OLED assembly and the protective cover. The protective cover is substantially transparent. A face of the other of the OLED assembly and the protective cover is positioned upon the liquid adhesive. The liquid adhesive is cured to adhere the protective cover to the OLED assembly.

Method of sealing OLED cover with liquid adhesive

A method of adhering a first panel, such as an OLED assembly, to a second panel, such as a protective cover plate, is disclosed. An adhesive is applied to a face of at least one of the first and second panels. The first panel is positioned to be responsive to movement of any of a plurality of independently controlled expandable elements. The second panel is held adjacent the first panel. At least one of the expandable elements is selectively expanded so that a first edge of the first panel contacts a first edge of the second panel. The expandable elements are further selectively expanded so that the adhesive fully contacts the first and second panels.

Panel-to-panel lamination method for improved uniformity

A method of sealing an Organic Light-Emitting Diode (OLED) assembly is disclosed. According to the method, a liquid adhesive is applied to substantially all of a surface of an OLED assembly. A region of increased thickness of liquid adhesive is formed adjacent to a first edge of the OLED assembly. A first edge of the protective cover is placed adjacent to the first edge of the OLED assembly. A second edge of the protective cover is moved toward a second edge of the OLED assembly such that the region of increased thickness of liquid adhesive is moved from being adjacent to the first edge of the OLED assembly to being adjacent to the second edge of the OLED assembly. The liquid adhesive is allowed to stabilize and is then cured.

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Robins, IA, United States of America

Vincent P Marzen