Rohm and Haas Electronic Materials Cmp Holdings, Inc.

Vincent Matthew Hedrick

Alan Saikin

Robert T Gamble

Jason M Lawhorn

Mark J Boldizar

Katherine L Tome

A method of forming a layered polishing pad is disclosed. The method includes double-laminating a subpad on opposing sides with respective adhesive layers and bonding a polishing pad top layer to the subpad via the upper adhesive layer. The polishing pad optionally includes a window. Because the subpad is double-laminated, an opening can be formed through both the top and bottom adhesive layers as well as the subpad. Thus, when bonded to a top polishing pad layer having a window, the result is a layered polishing pad with a through optical path that does not include an adhesive layer.

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Weston, FL, United States of America

Vincent Matthew Hedrick