Marvell International Limited

Lam Research Corporation

Jds Uniphase Corporation

Te Connectivity Solutions Gmbh

Measurement Specialties, Incorporated

Measurement Specialties (china) Ltd.

Te Connectivity Services Gmbh

Vincent M Wong

Jitendra Kumar Swarnkar

Gregory Burd

Jie Du

Henry T Chan

Zining Wu

Son Hong Ho

Chung-Ho Huang

Soichi Isono

Natasha V Kachenko

Chung Ho Huang

Ronald Ramnarine

Mukesh Shah

Robert Ahrens

Michael Madden

Heng Tang

Qiyue Zou

Brett C Richardson

Jay A Skidmore

Roger Patrick

Chad R Weetman

Paul Ballintine

Rainer Unterguggenberger

Dave Eric Wagner

Kar Shing Chiu

Robert Housley

Sandy Shih-Hsun Chao

Nitin Nangare

David J Hemker

Bo Liu

Ting Gao

David G Mehuys

Hongying Sheng

Edmund L Wolak

Miguel A Morales

David Eric Wagner

Jing Booth

Richard R Craig

Andrew Lui

Megan Hoarfrost Beers

Erik Paul Zucker

Ngoc-Diep Nguyen

Lin Zhang

Xu Liang

John Jensen

Scott Baldwin

Neal K Newton

Simon Gosselin

Chris Hart

Gerramine S Manuguid

Yun-Ho Wu

Vishrut Vipul Mehta

Tinghui (Felix) Fu

Long (Allen) Wang

Jonathan Tran

Raymond Chau

Yu Ding

Chris Thorgrimsson

Cuong Nguyen

Rakeshkumar K Patel

Tang Heng

Tuyen Nguyen

Randolph W Hines

Yilang Wu

Gottfried Rainer Dohle

Kerwin Hoversten

Marco Mora

Nicolas Grinschgl

A sensor assembly includes a sensor and an adapter connected to the sensor. The sensor includes a housing having a port and a cavity, a diaphragm disposed in the port and enclosing the cavity, and a sensing die disposed in the cavity. The diaphragm extends in a first plane. The adapter has a base section connected to the housing and an end section extending from the base section. The end section has a mating face that extends in a second plane perpendicular to the first plane. The mating face is attached to a manifold or a surface of a structure in which a pressure of a fluid medium is sensed by the sensor assembly. The adapter has an adapter passageway extending from the mating face through the base section of the adapter that connects the mating face to the port of the housing.

Sensor assembly

A data collection system for semiconductor manufacturing includes: T substrate processing tools, where each of the T substrate processing tools includes: N processing chambers, where each of the N processing chambers includes a processing chamber controller configured to receive a plurality of different types of data during operating of the corresponding one of the N processing chambers, where the plurality of different types of data have different formats, where the processing chamber controller is further configured to format the plurality of different types of data into formatted data, and where T and N are integers; and a data diagnostic services computer configured to: receive and store the formatted data as categories in a common file having a table-like data structure including rows with contextual data; and in response to a request, generate an output file including a subset of the data from the common file.

Data capture and transformation to support data analysis and machine learning for substrate manufacturing systems

A sensing device includes a body having a first chamber, a second chamber, and a liquid path which are filled with a liquid, the liquid path communicates with the second chamber, a pressure difference detection chip installed in the first chamber, and a pressure detection chip installed in the first chamber. The pressure difference detection chip seals an opening of the liquid path disposed on a bottom surface of the first chamber. The pressure difference detection chip detects a liquid pressure difference between the first chamber and the second chamber. The pressure detection chip detects a liquid pressure in the first chamber.

Sensing device

A sensor includes a housing having a body, a plurality of ports, and a plurality of cavities. The ports include a first port and a second port, and the cavities include a first cavity disposed in the first port and a second cavity disposed in the second port. The sensor includes a first diaphragm disposed in the first port and enclosing the first cavity and a second diaphragm disposed in the second port and enclosing the second cavity. The first diaphragm and the second diaphragm are coplanar with one another in a first plane. The sensor includes a die disposed in the first cavity and having a membrane that is deflectable according to a differential pressure between a first pressure in the first cavity and a second pressure in the second cavity. The die is attached to the housing along a second plane parallel to the first plane.

Sensor having a plurality of diaphragms

For etching tools, a neural network model is trained to predict optimum scheduling parameter values. The model is trained using data collected from preventive maintenance operations, recipe times, and wafer-less auto clean times as inputs. The model is used to capture underlying relationships between scheduling parameter values and various wafer processing scenarios to make predictions. Additionally, in tools used for multiple parallel material deposition processes, a nested neural network based model is trained using machine learning. The model is initially designed and trained offline using simulated data and then trained online using real tool data for predicting wafer routing path and scheduling. The model improves accuracy of scheduler pacing and achieves highest tool/fleet utilization, shortest wait times, and fastest throughput.

Model-based scheduling for substrate processing systems

A compressible element for a sensor assembly includes an elastomer matrix having a first compressibility and a plurality of closed areas distributed within the elastomer matrix and each surrounded by the elastomer matrix. Each of the closed areas has a second compressibility greater than the first compressibility.

Compressible element for a sensor assembly

The present application provides a sensor, relates to sensing technology field, the sensor includes a sensor body, a main circuit module disposed in the sensor body and an sensing assembly electrically connect to the main circuit module, and further includes a circuit protection module disposed at outside of the sensor body and electrically connected to the main circuit module. In the present application, the main circuit module and the sensing assembly are used as the core components to achieve the functions of sensing and information conversion of the sensor; the circuit protection module is disposed outside the sensor body to realize the circuit protection function of the sensor. Specifically, the sensor can pass the test of the lightning surge test standard IEC61000-4-5 surge, and can also protect from static electricity of a high level and the impact of the electric fast transient pulse group; in addition, since the circuit protection module is disposed outside of the sensor body and the inner volume of the sensor is not occupied, such that the circuit protection performance of the sensor is further optimized and improved without any change on the inherent structure of the sensor body.

Sensor with circuit protection module

A system includes an interface and a controller. The interface is configured to receive a state of a substrate processing tool comprising a plurality of process modules configured to process a substrate. The controller is configured to correlate the state with an input previously received by the substrate processing tool from the interface based on the state and to generate an output to control the substrate processing tool based on the correlation.

System and method for automating user interaction for semiconductor manufacturing equipment

Display screen with graphical user interface for supporting service maintenance and tracking activities in semiconductor tool

Integration of semiconductor tool maintenance operations on mobile devices to allow technicians to more accurately perform semiconductor tool maintenance and to allow more accurate analysis of data to improve maintenance procedures to be more repeatable, consistent, and efficient. Remote control of maintenance operations for the semiconductor tool via a portable electronic device decreases the time required to service semiconductor tools and thus increase throughput.

Mobile connectivity and control of semiconductor manufacturing equipment

A method for establishing a virtual tether between a mobile device and a semiconductor processing tool, the method including: obtaining, by a mobile device, a unique key associated with the semiconductor processing tool; establishing a unique pairing between the mobile device and the semiconductor processing tool based on the unique key that is obtained by the mobile device; in response to successfully establishing the unique pairing, authenticating a user of the mobile device for access to the semiconductor processing tool; in response to successfully authenticating the user, performing resource arbitration on the semiconductor processing tool which includes reserving one or more resources associated with the semiconductor processing tool based on a level of access granted to the user; monitoring an activity level of the mobile device over a period of time; and comparing the activity level to a predetermined activity level threshold.

Method, apparatus, and system for establishing a virtual tether between a mobile device and a semiconductor processing tool

Mobile device display screen with graphical user interface for supporting service maintenance and tracking activities in semiconductor tool

A differential pressure sensor includes a pressure sensing die comprising a semiconductor die, having a thinned portion forming a diaphragm. The diaphragm includes piezo-resistive elements that exhibit varying resistance based on force exerted on the diaphragm. A first support structure is bonded to a first surface of the semiconductor die, having an aperture defined through the support structure such that a first surface of the diaphragm is exposed through the aperture. A second support structure is bonded to the opposite side of the semiconductor die having an aperture aligned with the opposing side of the diaphragm. Electrical components in electrical communication with the piezo-resistive elements are arranged outside the region defined by the bond between the first and second support structures and the semiconductor die. An oil-filled volume may be defined between the semiconductor die and a harsh medium which transmits a fluid pressure to the die without the harsh medium contacting the die.

Differential pressure sensor

A system including a first first-in first-out (FIFO) module, a control module, and a second FIFO module. The first FIFO module is configured to receive, from a host, (i) a first block and (ii) a first logical block address corresponding to the first block, where the first block includes first data. The control module is configured to generate a second block, where the second block includes (i) the first data and (ii) the first logical block address. The second FIFO module is configured to receive a third block from the first FIFO module, where the third block includes a second logical block address, and to determine whether the third block is different than the first block depending on whether the second logical block address included in the third block is different than the first logical block address included in the second block.

Systems and methods for data-path protection

The present disclosure describes apparatuses and techniques of improved sequential-access of storage media. In some aspects an indication that a storage media interface failed to access a block of storage media is received during a sequential-access of the storage media and the storage media interface is caused to attempt to read a next block of the sequential-access subsequent the sector failed to be accessed during the same sequential-access.

Sequential-access of storage media

Growing community of inventors

San Francisco, CA, United States of America

Vincent M Wong