Finisar Corporation

Analog Devices,inc.

Arris Enterprises LLC

Arris Technology, Inc.

Vincent Lixiang Bu

Daniel Mahgerefteh

Xueyan Zheng

David B Bowler

Clarke V Greene

Xinfa Ma

Jianying Zhou

Shaoting Gu

Lawrence M Hrivnak

Gerard White

John Holobinko

Steven H Hersey

Kevin John McCallion

Yasuhiro Matsui

Bruce C Pratt

Xiang He

Keith E Benson

Michael Patrick Clark

Michael Baldwin Heiny

A packaged radio frequency (RF) module is disclosed. The module can include a substrate, a first die electrically and mechanically attached to the substrate, a second die electrically and mechanically attached to the substrate, an encapsulating material, and a lid attached to the substrate. The first die comprises a silicon-based die, such as an RF switch die, and the second die comprises a compound semiconductor die, such as an RF amplifier. The encapsulating material can protect electrical connections between the first die and the substrate. The substrate and the lid at least partially define an air cavity within which the first and the second die are mounted. An active surface of the second die is exposed to the air cavity.

Radio frequency communication systems

Improved systems and methods for delivering CATV content over a fiber optic network to a receiver.

CATV video and data transmission system with digital input

Improved systems and methods for delivering CATV content over a fiber optic network from a transmitter.

CATV video and data transmission system with RF input

In an embodiment, an optical communication system includes an optical transmitter and an optical discriminator. The optical transmitter is configured to emit a frequency modulated signal having a bit rate frequency and a frequency excursion between 20% and 80% of the bit rate frequency. The optical discriminator is configured to convert the frequency modulated signal to a substantially amplitude modulated signal and includes a delay line interferometer (DLI). The DLI includes an input, an output, a first optical path coupling optical signals from the input to the output and a second optical path coupling optical signals from the input to the output. The first and second optical paths have different lengths.

Optical filter for use in a laser transmitter

Thermal chirp compensation in a chirp managed laser. In one example embodiment, a laser package including a laser and an optical spectrum reshaper configured to convert frequency modulated optical signals from the laser into an amplitude modulated optical signals is provided. A thermal chirp compensation device is in communication with the laser package and a laser driver. The thermal chirp compensation device includes means for generating bias condition and temperature specific thermal chirp compensation signals that each corresponds to a predetermined level of thermal chirp that is induced in the laser by operating the laser at a particular bias condition and temperature.

Thermal chirp compensation in a chirp managed laser

Thermal chirp compensation in a chirp managed laser. In one example embodiment, a method for thermal chirp compensation in a chirp managed laser (CML) includes several acts. First, a first bias condition and temperature is selected. Next, a first thermal chirp compensation signal is generated. Then, the laser is driven by biasing a first input drive signal with the first thermal chirp compensation signal. Next, a second bias condition and temperature is selected. Then, a second thermal chirp compensation signal is generated. Finally, the laser is driven by biasing a second input drive signal with the second thermal chirp compensation signal.

Growing community of inventors

Wilmington, MA, United States of America

Vincent Lixiang Bu