Applied Materials, Inc.

Vincent Kirchhoff

Yao-Hung Yang

Shantanu Rajiv Gadgil

Kaushik Rao

Munirah Mahyudin

Daniel Chou

Sagir Kadiwala

John William Lane

Marcel E Josephson

Faruk Gungor

Mark A Crockett

Hong P Gao

Gary U Keppers

Felix Rabinovich

Bhaswan Manjunath

A lamp and epitaxial processing apparatus are described herein. In one example, the lamp includes a bulb, a filament, and a plurality of filament supports disposed in spaced-apart relation to the filament, each of the filament supports having a hook support and a hook. The hook includes a connector configured to fasten the hook to the hook support, a first vertical portion extending from the connector toward the filament, and a rounded portion extending from an end of the first vertical portion distal from the connector and configured to wrap around the filament. A second vertical portion extends from an end of the rounded portion distal from the first vertical portion and the second vertical portion has a length between 60% and 100% of the length of the first vertical portion.

High power tungsten halogen lamp lifetime improvement through J-hook design

Embodiments of an apparatus for gas delivery in a semiconductor processing system use a gas distribution plate that has a plurality of gas passageways where the passageways have surfaces with an average roughness of less than or equal to approximately 10 Ra. In some embodiments, the gas distribution plate has one or more internal fluid passageways that are capable of being fluidly coupled to one or more fluid sources to provide temperature control of the gas distribution plate. In some embodiments, the gas distribution plate has at least one internal cavity with at least one heatsink that may surround at least one of the plurality of gas passageways to provide, at least partial, temperature control of the gas distribution plate.

Apparatus and method for gas delivery in semiconductor process chambers

The present invention relates to a method of diffusion bonding of steel and steel alloys, to fabricate a fluid delivery system of the kind which would be useful in semiconductor processing and in other applications which require high purity fluid handling.

Method of diffusion bonding a fluid flow apparatus

Growing community of inventors

Morgan Hill, CA, United States of America

Vincent Kirchhoff