Western Digital Technologies, Inc.

Sandisk Technologies Inc.

Vincent Jiang

Paul Qu

Shixing Zhu

Hope Chiu

Zengyu Zhou

Rui Yuan

Yi Su

Kevin Du

Guangqiang Li

Jingyun Chen

Lian Chen

Enoch He

Virgil Zhu

Yonglong Liu

Yuanheng Zhang

Alex Zhang

A method of soldering one or more components to a substrate includes providing a substrate and applying an amount of solder material to the top planar surface of the substrate. One or more electrical components are mounted to the solder material in a predetermined position and orientation. A carrier is provided having one or more magnets embedded therein. The substrate is positioned above the carrier such that each of the one or more magnets is positioned directly below a corresponding electrical component. A carrier cover is positioned above the substrate and the electrical components. The solder material is heated to a predetermined temperature for a predetermined amount of time during which each of the magnets exerts a magnetic force on a corresponding electrical component to maintain its orientation relative to the substrate. The magnets reduce the occurrence of tombstoning of the electrical components during heating of the solder material.

Surface mount technology method and magnetic carrier system

A packaged semiconductor includes a substrate and a first component disposed on the substrate. The package includes an underfill that is dispensed under and around the first component. The package also includes a second component disposed on the substrate adjacent to the first component that provides a border to the underfill.

Reducing keep-out-zone area for a semiconductor device

Growing community of inventors

Shanghai, China

Vincent Jiang