Thales

Thomson-csf

Vincent Jahier

Alain Grancher

Jean-Yves Daden

Michel Giraudo

G&eacute;rard Cachier

Ludovic Michel

Marie-Pierre Dussauby

Christophe Flouzat

Muriel Gohn-Devineau

Pascal Etourneau

A device associated with the control of a tractable filter, including: an induction coil having an inductance Ls, and a resistance Rs; a series resistance rhaving a value determined from a parallel resistance of the induction coil, L, the inductance at the resonance frequency, &#x3c9;the resonance frequency, and by taking the lowest resistance value and by deducing rfrom R=r+Rs.

Method and device for optimising the adjustment time of an adjustable filter

The invention relates to a wireless transmitting and receiving module including a radiofrequency module filtering and amplifying the wireless signals received, a high intermediate frequency module transposing the wireless signals received to a high intermediate frequency, the transpositions being carried out by mixing of the wireless signals with signals of known frequency generated by local oscillator modules, and a low intermediate frequency module transposing the wireless signals received to a low intermediate frequency. In particular, the invention applies to the radiocommunication software modules that can receive and/or transmit on the broad band, that is to say in a frequency range from 30 MHz to 3 GHz.

Radioelectric transmission and reception module mainly intended for broad-band radio-communications

The surface mounting of a backset microwave package on a printed circuit. After the package has been accurately positioned against the printed circuit the connections are produced by soldering the conducting elements in direct contact. A chip is enclosed in a sort of cage constituting a screen which replaces a conventional cover, the cage is formed by layouts borne respectively by the package and the printed circuit and is linked together by metal links. The surface mounting is particularly applicable to packages operating in millimetric microwaves.

Method for surface mounting of a microwave package on a printed circuit and package and printed circuit for implementing said method

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St Leu la Foret, France

Vincent Jahier