Motorola Corporation

Vincent J Pellechia

Barry C Johnson

A brazing operation, using a silver-copper alloy preform in a temperature range of from 800.degree. C. to 1100.degree. C., is employed to attach either radial or axial conductive leads to ceramic non-linear resistors or capacitors, thereby eliminating the necessity of titanium-silver vacuum deposition or conductive cermet application prior to lead attachment. Glass encapsulation may be accomplished simultaneous with the brazing operation to further reduce cost.

Low cost assembly processes for non-linear resistors and ceramic

A low cost two step process for attaching conductive leads and heat dissipating elements and for encapsulating a ceramic non-linear resistor pellet is described. Low temperature soldering techniques are utilized to assemble the device. Low temperature soldering is made feasible by the treatment of the attaching surfaces of the pellet with a dilute solution of acid for reducing the oxide surface to a pure metal in preparation for soldering.

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Scottsdale, AZ, United States of America

Vincent J Pellechia