Lucent Technologies Inc.

At+t Corp.

Vincent George Lambrecht, Jr

John Thomson, Jr

David Wilfred Johnson

Debra Anne Fleming

Henry Hon Law

Apurba Roy

Gideon S Grader

David John DiGiovanni

Allan James Bruce

Te-Sung Wu

Philippe C Becker

David Joseph Liptack

The invention provides an improved process for fabricating devices containing metallized magnetic ceramic material, such as inductors, transformers, and magnetic substrates. In particular, the unique vias utilized in the process of the invention allow fabrication of devices from multiple unfired ferrite layers with only a single via-coating step, thereby avoiding the need numerous punching steps. Moreover, there is no need for expanding the dimensions of the vias and thus no need for internal metallization. The invention therefore provides for green tape-type fabrication of devices such as inductors, transformers, and magnetic substrates in a manner faster, less complex, and more reliable than current methods. The invention also relates to use of an improved conductive material in such a process, the conductive material containing silver/palladium particles, ferrite particles, a cellulose-based or other organic binder, and a solvent. After firing of the substrate onto which the ink has been coated, and plating of copper thereon by a copper pyrophosphate bath, the plated copper exhibits a pull strength greater than about 4 kpsi, advantageously greater than about 5 kpsi. Use of a copper pyrophosphate bath also allow uniform plating within long, narrow vias.

Process for forming device comprising metallized magnetic substrates

The method of making a metallized magnetic substrate for devices including a magnetic component involves providing an unfired ceramic body. In one exemplary embodiment, the method further involves making one or more vias through the ceramic body, coating the via side walls with conductive material, forming an aperture through the ceramic body, such that an aperture edge intersects the via, and metallizing the unfired ceramic body such that a conductive pathway is formed that includes the conductive material in the via. Finally, the metallized unfired ceramic body is fired in conventional fashion, optionally followed by deposition of additional conductor material.

Method of making a device including a metallized magnetic substrate

The thickness uniformity of a plated metal layer inside a via hole can be enhanced by intersecting a conductive via with an insulating aperture before plating. The new via configuration improves the mass transfer of the plating. It is believed that the apertures lower the local solution ohmic resistance near the via holes. The method can be applied to the manufacture of a wide variety of circuit boards.

Method for fabricating highly conductive vias

A chalcogenide glass that is doped with praseodymium and contains a rare earth metal is disclosed. The rare earth metal is at least 10 mole percent of the metals in the glass. The concentration of the praseodymium in the glass is at least 200 ppm. The chalcogenide glass, when formed into an amplifier for an optical fiber transmission system, efficiently amplifies optical signals in the signal band of 1.3 .mu.m.

Optical fiber amplifier and a glass therefor

Growing community of inventors

Millington, NJ, United States of America

Vincent George Lambrecht, Jr