Lam Research Corporation

Novellus Systems Incorporated

Vince Burkhart

Karl Frederick Leeser

Sunil Kapoor

Hyungjoon Kim

Christopher Ramsayer

Mohan Thilagaraj

David Michael French

Damien Martin Slevin

Timothy Scott Thomas

Joel Philip Hollingsworth

Martin Freeborn

A method includes: receiving a first signal from a first sensor at a first filter and preventing passage of a first portion of the first signal via the first filter. The first portion of the first signal is at a first RF. A second portion of the first signal is indicative of a first temperature of a first electrode in a plasma chamber. The method further includes: outputting a second signal from the first filter; receiving the second signal at a second filter; and preventing passage of a portion of the second signal via the second filter. The portion of the second signal is at a second RF. The second RF is less than the first RF. The first filter and the second filter are implemented on a printed circuit board. The method further includes adjusting a temperature of the first electrode based on an output of the second filter.

Systems and methods for filtering radio frequencies from a signal of a thermocouple and controlling a temperature of an electrode in a plasma chamber

An isolation system includes an input junction coupled to one or more RF power supplies via a match network for receiving radio frequency (RF) power. The isolation system further includes a plurality of channel paths connected to the input junction for distributing the RF power among the channel paths. The isolation system includes an output junction connected between each of the channel paths and to an electrode of a plasma chamber for receiving portions of the distributed RF power to output combined power and providing the combined RF power to the electrode. Each of the channel paths includes bottom and top capacitors for blocking a signal of the different type than that of the RF power. The isolation system avoids a risk of electrical arcing created by a voltage difference between an RF terminal and a non-RF terminal when the terminals are placed proximate to each other.

Apparatuses and methods for avoiding electrical breakdown from RF terminal to adjacent non-RF terminal

A thermal choke rod connecting a radio frequency source to a substrate support of a plasma processing system includes a tubular member having a first connector for connecting to an RF rod coupled to the substrate support and a second connector for connecting to an RF strap that couples to the RF source. A tubular segment extends between the first and second connectors. The first connector has a conically-shaped end region that tapers away from the inner surface thereof to an outer surface in a direction toward the tubular segment, and slits that extend for a prescribed distance from a terminal end of the first connector. The outer surface of the tubular segment has a threaded region for threaded engagement with an annular cap that fits over the first connector and reduces an inner diameter of the first connector upon contact with the conically-shaped end region of the first connector.

High temperature RF connection with integral thermal choke

A circuit including a first filter assembly and a controller. The first filter assembly is implemented on a printed circuit board. The first filter assembly includes a first filter and a second filter. The first filter receives a first signal from a first sensor, prevents passage of a first portion of the first signal and outputs a second signal. The first portion of the first signal is at a first radio frequency. A second portion of the first signal is indicative of a first temperature of a first electrode in a plasma chamber. The second filter receives the second signal and prevents passage of a portion of the second signal. The portion of the second signal is at a second radio frequency. The second radio frequency is less than the first radio frequency. The controller adjusts a temperature of the first electrode based on an output of the second filter.

A plasma ignition system includes a first voltage supply that selectively supplies a plasma ignition voltage and a plasma maintenance voltage across an adapter ring and a cathode target of a physical vapor deposition (PVD) system. A second voltage supply selectively supplies a second voltage across the adapter ring and an anode ring of the PVD system. A plasma ignition control module ignites plasma using the plasma ignition voltage and the auxiliary plasma ignition voltage and, after the plasma ignites, supplies the plasma maintenance voltage and ceases supplying the plasma ignition voltage and the auxiliary plasma ignition voltage.

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Cupertino, CA, United States of America

Vince Burkhart