Qualcomm Incorporated

Vinayak Nana Mehetre

Ronald Alton

Giby Samson

Harshat Pant

Mohammed Yousuff Shariff

Keyurkumar Karsanbhai Kansagra

Louis Louie

Sumarlin William

Thermal management aspects include a serial databus; a central processing unit (CPU); a graphics processing unit (GPU); a neural signal processor (NSP); an always on subsystem (AOSS); the serial databus, the CPU, the GPU, the NSP and the AOSS are implemented on a system on a chip; wherein the CPU includes a first plurality of thermal sensors and a first plurality of controllers, each of the first plurality of thermal sensors is coupled to each of the first plurality of controllers; wherein the NSP includes a second plurality of thermal sensors and a second plurality of controllers, each of the second plurality of thermal sensors is coupled to each of the second plurality of controllers; and wherein the AOSS includes a third plurality of thermal sensors and a third plurality of controllers, each of the third plurality of thermal sensors is coupled to each of the third plurality of controllers.

Distributed thermal management architecture

A system on chip (SOC) includes a power distribution network (PDN) that has two different types of power multiplexers. The first power multiplexer type includes a lower resistance switching logic, and the second type includes a higher resistance switching logic as well as digital logic to provide an enable signal to the first type of power multiplexer. A given first-type power multiplexer may have multiple power multiplexers of the second type in a loop, the loop including communication paths for the enable signal and feeding the enable signal back to an enable input of the first-type power multiplexer.

Systems and methods for adaptive power multiplexing with a first type of power multiplexer and a second type of power multiplexer

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Bengaluru, India

Vinayak Nana Mehetre