Qualcomm Incorporated

Vinay Mitter

Unnikrishnan Vadakkanmaruveedu

Ankur Jain

Paras S Doshi

Jon James Anderson

Anil Vootukuru

Peng Wang

Ronald Alton

Richard Alan Stewart

Serag Gadelrab

Paul Chow

Vinod Chamarty

Christopher L Medrano

Roy Benjamin Silverstein

Cristian Duroiu

Praveen Kumar Chidambaram

Vinodh Ramesh Cuppu

Joseph Schweiray Lee

Henri Begin

Johnny Jone Wai Kuan

Ruolong Liu

Pooja Sinha

John Daniel Chaparro

Unni Vadakkanmaruveedu

Mulugeta K Berhe

Zenghui Zhao

Steven Der-Chung Cheng

Christopher Lee Medrano

Ronald F Alton

An active heat transfer device is proposed for heat management in apparatuses such as mobile devices. The proposed heat transfer device may include a thermoelectric (TE) layer, and first and second electrodes both on lateral surfaces of the TE layer. When there is a voltage differential between the first and second electrodes, heat from a heat source may be transferred laterally within the TE layer from the first electrode to the second electrode.

In-plane active cooling device for mobile electronics

An electronic device includes a housing with a plurality of sides and electronics components in the housing. A porous and thermally conductive material is associated with the housing. The material has a thermal conductively (k), and a porosity between 10% and 70% that results in a specific heat (&#x3c1;) and density (C) for the material, such that k*&#x3c1;*Cis between 0 (J*W)/(m*K) and 1,000,000 (J*W)/(m*K). The material may be: a glass-based material having a thermal conductivity between 0.5-2 W/m-K, a density between 1000-2500 kg/m, and a specific heat between 500-1000 J/kg-K; a metal-based material having a thermal conductivity between 300-400 W/m-K, a density between 4000-8000 kg/m, and a specific heat between 200-300 J/kg-K; and a plastic-based material having a thermal conductivity may be between 0.1-0.4 W/m-K, a density between 400-1000 kg/m, and a specific heat between 1900-2000 J/kg-K.

Skin material design to reduce touch temperature

A method and system for adjusting bandwidth within a portable computing device based on danger signals monitored from one on more elements of the portable computing device are disclosed. A danger level of an unacceptable deadline miss ('UDM') element of the portable computing device may be determined with a danger level sensor within the UDM element. Next, a quality of service ('QoS') controller may adjust a magnitude for one or more danger levels received based on the UDM element type that generated the danger level and based on a potential fault condition type associated with the particular danger level. The danger levels received from one UDM element may be mapped to at least one of another UDM element and a non-UDM element. A quality of service policy for each UDM element and non-UDM element may be mapped in accordance with the danger levels.

System and method for dynamic bandwidth throttling based on danger signals monitored from one more elements utilizing shared resources

Thermal management in a portable computing device differentiates between a temperature increase caused by a steady workload and a temperature increase caused by an instantaneous workload. If it is determined that a detected temperature increase is caused by a steady workload, then a configuration of thermal parameters is applied that optimizes thermal performance for a steady workload. If it is determined that a temperature increase is caused by an instantaneous workload increase, then a configuration of thermal parameters is applied that optimizes thermal performance for an instantaneous workload.

Thermal management in a computing device based on workload detection

The various embodiments provide methods and systems for adjusting the thermal mitigation system of a mobile electronic device when an add-on outer casing is attached. The mobile electronic device determine whether an add-on outer case is attached to the mobile electronic device and change a thermal mitigation parameter of a thermal mitigation process implemented on the mobile electronic device in response. The determination may be via a sensor or a user input. A changed thermal mitigation parameter may be stored in memory, or input by a user or in a communication from the add-on case. The changed thermal mitigation parameter may be determined based on a particular make, model or properties of the add-on case, and/or may be obtained from a database stored in the device or accessed via a network. Removal of the case may be detected and the thermal mitigation parameter returned to an initial value.

Thermal mitigation adaptation for a mobile electronic device

Various embodiments of methods and systems for thermal energy management in a portable computing device ('PCD') based on power level calculations are disclosed. An exemplary method includes tracking instantaneous operating temperatures and active power supply levels to one or more components. With an estimate or measurement of ambient temperature, the instantaneous operating temperature values and active power supply level values can be used to calculate an instantaneous thermal resistance value. In the event that thermal energy generation should be managed, a target operating temperature may be used with the ambient temperature and the instantaneous thermal resistance value to solve for an optimum power supply level. The active power supply level may then be adjusted based on the calculated optimum power supply level.

System and method for thermal management in a portable computing device using thermal resistance values to predict optimum power levels

Various embodiments of methods and systems for idle state optimization in a portable computing device ('PCD') are disclosed. An exemplary method includes comparing an aggregate power consumption level for all processing cores in the PCD to a power budget and, if there is available headroom in the power budget, transitioning cores operating in a first idle state to a different idle state. In doing so, the latency value associated with bringing the transitioned cores out of an idle state and into an active state, should the need arise, may be reduced. The result is that user experience and QoS may be improved as an otherwise idle core in an idle state with a long latency time may be better positioned to quickly transition to an active state and process a workload.

System and method for idle state optimization in a multi-processor system on a chip

Various embodiments of methods and systems for adaptive thermal management techniques implemented in a portable computing device ('PCD') are disclosed. Notably, in many PCDs, temperature thresholds associated with various components in the PCD such as, but not limited to, die junction temperatures, package on package ('PoP') memory temperatures and the &#x201c;touch temperature&#x201d; of the external surfaces of the device itself limits the extent to which the performance capabilities of the PCD can be exploited. It is an advantage of the various embodiments of methods and systems for adaptive thermal management that, when a temperature threshold is violated, the performance of the PCD is sacrificed only as much and for as long as necessary to clear the violation before authorizing the thermally aggressive processing component(s) to return to a maximum operating power.

System and method for adaptive thermal management in a portable computing device

Various embodiments of methods and systems for dynamically managing the capacity utilization of a memory component in a system on a chip ('SoC') are disclosed. Memory utilization is optimized in certain embodiments through dynamic compression and decompression within a memory subsystem. Based on parameters of the SoC that are indicative of a quality of service ('QoS') level, a memory controller may determine that the format of the data in a write request should be converted and stored in a relinked memory address. Subsequently, a primary memory address associated with the data may be released for storage of different data. Similarly, embodiments may return data requested in a write request in a format different than that which was requested.

Dynamic memory utilization in a system on a chip

Various embodiments of methods and systems for estimating environmental ambient temperature of a portable computing device ('PCD') from electrical resistance measurements taken voice coils in a speaker or microphone component are disclosed. In an exemplary embodiment, it may be recognized that the PCD is in an idle state, thus producing little or no thermal energy. Electrical resistance measurements are taken from a voice coil and used to estimate the environmental ambient temperature to which the PCD is exposed. Certain embodiments may simply render the estimated ambient temperature for the benefit of the user or use the estimated ambient temperature as an input to a program or application running on the PCD. It is envisioned that certain embodiments of the systems and methods may use the estimated ambient temperature to adjust temperature thresholds in the PCD against which thermal management policies govern thermally aggressive processing components.

System and method for estimating ambient temperature of a portable computing device using a voice coil

An apparatus for managing heat generated by at least one electronic component of a mobile device, the apparatus comprising: a housing for containing the electronic component of the mobile device; and a vapor chamber arranged in the housing, the vapor chamber having a cavity defined by a front wall and a rear wall opposite the rear wall, the front wall for receiving heat generated by the electronic component of the mobile device to evaporate fluid in the cavity into a vapor, the rear wall for receiving the vapor to allow the vapor to condense to liquid thereby cooling the rear wall of the vapor chamber; wherein an outer surface of the housing comprises at least a portion of the rear wall of the vapor chamber.

Vapor chambers based skin material for smartphones and mobile devices

A method and system for managing a thermal policy of a receiving device that couples to a portable computing device (PCD) includes automatically detecting a presence of the PCD. After detecting the presence of the PCD, a command to deactivate a thermal sensor and to deactivate a power supply within the PCD may be issued. The thermal policy manager module of the receiving device may issue a command to adjust an operating condition of a processor within the PCD if a temperature value reaches a predetermined value. The thermal policy manager module may also adjust operation of an active cooling device if the temperature value sensed by a sensor within the PCD reaches a predetermined value. The receiving device may include at least one of a docking station, a tablet personal computer, a laptop personal computer, a desktop personal computer, a portable media player, a portable television, and a printer.

System and method for managing a thermal policy of a receiving device that couples to a portable computing device

Adaptive thermal management in a portable computing device including monitoring a temperature signal and holding a performance level during a penalty period

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San Diego, CA, United States of America

Vinay Mitter