Heptagon Micro Optics Pte. Ltd.

Ams Sensors Singapore Pte. Ltd.

Ville Kettunen

Markus Rossi

Hartmut Rudmann

Alexander Bietsch

Stephan Heimgartner

Mario Cesana

Jukka Alasirnio

Nicola Spring

Robert Lenart

Daniel Dias

Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.

Optical modules including focal length adjustment and fabrication of the optical modules

An illumination system including at least one light source such as an electroluminescent element, e.g. a light emitting diode (LED), and at least one optical element whose surface is structured by diffraction and/or refraction type optical microstructures. In order to shape the beam, the optical element includes at least two sections whose optical microstructures and therefore optical properties are different from one another. The pattern of the microstructures in each of the at least two sections is, at least over a predetermined angular range, rotationally symmetric with respect to the optical axis or another symmetry axis.

Illumination system

The optical apparatus comprises a semiconductor substrate and at least one optics substrate. The semiconductor substrate comprises a first active region establishing a first image sensor, said semiconductor substrate further comprising an additional active region, different from said first active region. The additional active region establishes or is part of an additional sensor which is not an image sensor. And the at least one optics substrate comprises for said first image sensor at least one lens element for imaging light impinging on the optical apparatus from a front side onto the first image sensor. Preferably, at least two or rather at least three image sensors are provided, such that a computational camera can be realized. The additional sensor may comprise, e.g., an ambient light sensor and/or a proximity sensor.

Optical imaging apparatus, in particular for computational imaging, having further functionality

An opto-electronic module includes a detecting channel comprising a detecting member for detecting light and an emission channel comprising an emission member for emitting light generally detectable by said detecting member. Therein, a radiation distribution characteristic for an emission of light from said emission channel is non rotationally symmetric; and/or a sensitivity distribution characteristic for a detection in said detecting channel of light incident on said detection channel is non rotationally symmetric; and/or a central or main emission direction for an emission of light from said emission channel and a central or main detection direction for a detection of light incident on said detection channel are aligned not parallel to each other; and/or at least a first one of the channels comprises one or more passive optical components.

Opto-electronic module and devices comprising the same

An optical module for a camera device, the camera device including an image capturing element arranged on a base substrate portion, and has a top lens element and optionally further lens elements for imaging an object on the image capturing element, and further a baffle defining a predetermined field of view of the image capturing element. The baffle includes a generally transparent baffle substrate portion having a front surface and a rear surface, a generally non-transparent first layer with a plurality of first openings on the front surface and a generally non-transparent second layer with a plurality of second openings on the rear surface. The top lens element is arranged on the front and/or the rear surface of the baffle substrate, which leads to a reduced number layers/substrates in the module and to a reduced number of reflections on material-air interfaces, for example. The baffle has an improved ability to suppress unwanted light and enables protection of the inner part of the device as well as manufacture on wafer scale.

Optical module for a camera device, baffle substrate, wafer scale package, and manufacturing methods therefor

A light emitting device includes an electroluminescent element (), a housing () and current supply device for the electroluminescent element. A micro-optical element () is coupled to the housing () and arranged such that it influences light emitted by the electroluminescent element (). The micro-optical element may be made up of micro-optical structures on a surface of an at least partially transparent layer () coupled to the housing (). The micro-optical structures may, for example, be manufactured by directly imprinting them on the at least partially transparent layer () coupled to the housing or by casting an at least partially transparent layer () including the electroluminescent element to a body of the light emitting device. The diffractive optical features of the micro-optical element () are designed according to the position, size and shape of the one or more electroluminescent elements (), and output light distribution of the one or more electroluminescent elements ().

Growing community of inventors

Ruschlikon, Switzerland

Ville Kettunen