Tesla, Inc.

Vijaykumar Krithivasan

Mengzhi Pang

Yang Sun

Ganesh Venkataramanan

Shishuang Sun

Jin Zhao

Steven Wayne Butler

Mitchell Heschke

Robert Yinan Cao

Described is a multi-chip module that may include a Redistribution Layer (RDL) substrate having Integrated Circuit (IC) dies mounted to a first surface of the RDL substrate. A second plurality of IC dies may be mounted to an opposite second surface. A plurality of sockets can be mounted upon the second plurality of IC dies and a cold plate then mounted to the first plurality of IC dies. The mounting structure may include socket frames coupled to the plurality of sockets.

Mechanical architecture for a multi-chip module

A structure having imbedded array of components is described. An example structure includes an imbedded component array layer having an array of imbedded passive devices contained therein. The structure further includes an Integrated Fan-Out (InFO) layer residing adjacent a first surface of the imbedded component array layer having traces and vias formed therein. The structure further includes an insulator layer residing adjacent a second surface of the imbedded component array layer and electrically coupled to at least the InFO layer and vias passing through the imbedded component array layer and electrically coupled to some of vias of the InFO layer.

Packaged device having imbedded array of components

Growing community of inventors

Mountain View, CA, United States of America

Vijaykumar Krithivasan