Applied Materials, Inc.

Vijayabhaskara Venkatagiriyappa

Mihaela A Balseanu

Mario Dave Silvetti

Keiichi Tanaka

Nitin Bhargav

Tae Kwang Lee

Srinivas Ramakrishna

Francis Kanyiri Mungai

Mandyam Sriram

Abhishek Chowdhury

Sriharish Srinivasan

Jyoti Prakash Deo

Yung-Cheng Hsu

Mario Daniel Sanchez

Apparatus and method for removing material from the susceptor of a batch processing chamber are described. The apparatus comprises a polishing tool including a rotatable platen positioned above the susceptor. A method comprises contacting material deposited on the susceptor with the rotatable platen to remove the material from the susceptor.

Apparatus and methods for susceptor deposition material removal

Lid separators for vacuum processing chamber lid separation and vacuum processing chambers incorporating same are provided herein. In some embodiments, a lid separator for a vacuum processing chamber includes: a shaft having a first end and an opposing second end, wherein the shaft is threaded along at least a first portion of the shaft; and a contact pad having an outer diameter greater than an outer diameter of the shaft, a recess disposed in a first side of the contact pad, and a central opening disposed through a second side of the contact pad, opposite the first side, and into the recess, wherein the shaft is coupled to the contact pad, wherein the first end of the shaft extends through the central opening and into the recess without reaching the first side of the contact pad, and wherein the first portion and the second end of the shaft extend away from the second side of the contact pad.

Lid separation device for vacuum chamber

Methods for modifying a susceptor having a silicon carbide (SiC) surface comprising exposing the silicon carbide surface (SiC) to an atmospheric plasma are described. The method increases the atomic oxygen content of the silicon carbide (SiC) surface.

Plasma induced modification of silicon carbide surface

Apparatus and methods for vacuum chucking a substrate to a susceptor. The susceptor comprises one or more angularly spaced pockets are positioned around a center axis of the susceptor, the one or more angularly spaced pockets having an inner pocket and an outer pocket. The susceptor can be configured as an intermediate chuck having one or more pucks positioned within the inner pocket or as a distributed chuck having one or more pucks positioned within the outer pocket. The one or more pucks has a center hole, at least one radial channel and at least one circular channel having chuck holes for vacuum chucking a substrate.

Susceptor wafer chucks for bowed wafers

Growing community of inventors

Bengaluru, India

Vijayabhaskara Venkatagiriyappa