Raychem Limited

Vijay N Reddy

Edward F Chu

Robert P Saltman

Daniel A Chandler

George B Park

James A Rinde

Stephen Michael Baigrie

Nelson H Thein

A conductive polymer composition containing a particulate conductive filler dispersed in a polymeric component. The polymeric component comprises a first polymer which (i) is present in an amount 25 to 75% by weight of the total polymeric component, and (ii) is polyethylene, and a second polymer which (i) is present in an amount 25 to 75% by weight of the total polymeric component, and (ii) comprises units derived from a first monomer which is ethylene and a second monomer which is an alkyl acrylate having the formula --CH.sub.2 .dbd.CHCOOC.sub.m H.sub.2m+1 --, where m is at least 4. The resulting composition is useful in preparing electrical devices, e.g. circuit protection devices, which have lower resistivities, higher PTC anomalies, and better thermal and electrical stability than devices comprising conventional conductive polymer compositions.

Conductive polymer composition

A conductive polymer composition containing a particulate conductive filler dispersed in a polymeric component. The polymeric component comprises a first polymer which (i) is present in an amount 25 to 75% by weight of the total polymeric component, and (ii) is polyethylene, and a second polymer which (i) is present in an amount 25 to 75% by weight of the total polymeric component, and (ii) comprises units derived from a first monomer which is ethylene and a second monomer which is an alkyl acrylate having the formula --CH.sub.2 .dbd.CHCOOC.sub.m H.sub.2m+1, where m is at least 4. The resulting composition is useful in preparing electrical devices, e.g. circuit protection devices, which have lower resistivities, higher PTC anomalies, and better thermal and electrical stability than devices comprising conventional conductive polymer compositions.

Conductive polymer composition and device

A conductive polymer composition in which a particulate conductive filler is dispsered in a polymeric component which is a mixture of an essentially amorphous thermoplastic resin and a thermosetting resin. In preferred compositions, the amorphous thermoplastic resin and the thermosetting resin are substantially mutually soluble. In order to improve the thermal stability of the composition on exposure to successive thermal cycles, it is preferred that the composition be cured by heating the uncured mixture of amorphous thermoplastic resin, thermosetting resin, and particulate conductive filler at a rate of at least 15.degree. C./minute to the cure temperature.

A composition which contains 35 to 85% by weight of a copolymer of tetrafluoroethylene and hexafluoropropylene (FEP), 10 to 60% by weight of a copolymer of tetrafluoroethylene and perfluoropropylvinyl ether (PFA), and 5 to 60% by weight of melt-processable polytetrafluoroethylene (PTFE). The composition is particularly suitable for use as an insulating material on a substrate such as a resistive element in a conductive polymer heating cable. The composition has good physical properties, low creep, and low secondary crystallization, and exhibits little stress-cracking when exposed to elevated temperatures.

Fluoropolymer compositions

A conductive polymer composition in which a particulate conductive filler is dispersed in a polymeric component which is a mixture of an essentially amorphous thermoplastic resin and a thermosetting resin. In preferred compositions, the amorphous thermoplastic resin and the thermosetting resin are substantially mutually soluble. In order to improve the thermal stability of the composition on exposure to successive thermal cycles, it is preferred that the composition be cured by heating the uncured mixture of amorphous thermoplastic resin, thermosetting resin, and particulate conductive filler at a rate of at least 15.degree. C./minute to the cure temperature.

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San Mateo, CA, United States of America

Vijay N Reddy