Apple Inc.

Other

William Marsh Rice University

Baylor College of Medicine

Intelligent Energy Inc.

Vijay M Iyer

Gregory L Tice

Jean Ling Lee

Bradley Landon Spare

Michael D Hillman

David I Simon

Michael J Bishop

Jason S Pelc

Brett C Bilbrey

Aleksandar Pance

Peter M Arnold

Mario J Costello

Peter Saggau

Alex Goldis

Reid A Black

Duemani Reddy

Lexie Nicole Schachne

Described herein are one or more methods for integrating an optical component into an integrated photonics device. The die including a light source, an outcoupler, or both, may be bonded to a wafer having a cavity. The die can be encapsulated using an insulating material, such as an overmold, that surrounds its edges. Another (or the same) insulating material can surround conductive posts. Portions of the die, the overmold, and optionally, the conductive posts can be removed using a grinding and polishing process to create a planar top surface. The planar top surface enables flip-chip bonding and an improved connection to a heat sink. The process can continue with forming one or more additional conductive layers and/or insulating layers and electrically connecting the p-side and n-side contacts of the laser to a source.

Laser integration techniques

An integrated photonics device that emits light out towards a measured sample value is disclosed. The device can include a discrete optical unit that attaches to a supporting layer. The discrete optical unit can include mirror(s), optics, detector array(s), and traces. The supporting layer can include one or more cavities having facet walls. Light emitter(s) can emit light that propagate through waveguide(s). The emitted light can exit the waveguide(s) (via termination point(s)), enter the one or more cavities at the facet walls, and be received by receiving facets of the discrete optical unit. The mirror(s) of the discrete optical unit can redirect the received light towards collimating optics, which can direct the light out of the device through the system interface. The discrete optical unit can be formed separately from the supporting layer or bonded to the supporting layer after the mirror, optics, detector arrays, and traces are formed.

Discrete optical unit on a substrate of an integrated photonics chip

This disclosure relates to an integrated thermoelectric cooler and methods for forming thereof. The integrated thermoelectric cooler can include a plurality of thermoelectric rods located between the detector substrate and a system interposer. The detector substrate and the system interposer can directly contact ends of the thermoelectric rods. The integrated thermoelectric cooler can be formed by forming the plurality of thermoelectric rods on reels, for example, and the plurality of thermoelectric rods can be thinned down to a certain height. The thermoelectric rods can be transferred and bonded to the system substrate. An overmold can be formed around the plurality of thermoelectric rods. The height of the overmold and thermoelectric rods can be thinned down to another height. The thermoelectric rods can be bonded to the detector substrate. In some examples, the overmold can be removed.

Systems and methods for forming thin bulk junction thermoelectric devices in package

Described herein is an integrated photonics device including a light emitter, integrated edge outcoupler(s), optics, and a detector array. The device can include a hermetically sealed enclosure. The hermetic seal can reduce the amount of moisture and/or contamination that may affect the measurement, analysis, and/or the function of the individual components within the sealed enclosure. Additionally or alternatively, the hermetic seal can be used to protect the components within the enclosure from environmental contamination induced during the manufacturing, packaging, and/or shipping process. The outcoupler(s) can be formed by creating one or more pockets in the layers of a die. Outcoupler material can be formed in the pocket and, optionally, subsequent layers can be deposited on top. The edge of the die can be polished until a targeted polish plane is achieved. Once the outcoupler is formed, the die can be flipped over and other components can be formed.

Integrated photonics device having integrated edge outcouplers

The disclosed embodiments relate to the design of a portable and cost-effective fuel cell system for a portable computing device. This fuel cell system includes a fuel cell stack which converts fuel into electrical power. It also includes a fuel source for the fuel cell stack and a controller which controls operation of the fuel cell system. The fuel system also includes an interface to the portable computing device, wherein the interface comprises a power link that provides power to the portable computing device, and a bidirectional communication link that provides bidirectional communication between the portable computing device and the controller for the fuel cell system.

Portable computing device for external fuel cell control

The disclosed embodiments provide a fuel cell plate. The fuel cell plate includes a substrate of electrically conductive material and a first outer layer of corrosion-resistant material bonded to a first portion of the substrate. To reduce the weight of the fuel cell plate, the electrically conductive material and the corrosion-resistant material are selected to be as light as practicable.

Reduced-weight fuel cell plate with corrosion resistant coating

Fuel cell system to power a portable computing device

Security devices and methods of securely coupling electronic devices and peripherals are provided. In one embodiment, a peripheral has a first coded magnet on a first surface of a first device. The first coded magnet has at least two different polarity regions on the first surface. A second coded magnet on a second surface of a second device is also provided. The first coded magnet is configured to securely provide data to a device associated with the second coded magnet, if the first and second coded magnets' patterns are keyed to one another.

Magnetically-implemented security devices

The disclosed embodiments relate to the design of a fuel cell system which is capable of both providing power to and receiving power from a rechargeable battery in a portable computing device. This eliminates the need for a bulky and heavy battery within the fuel cell system, which can significantly reduce the size, weight and cost of the fuel cell system. This fuel cell system includes a fuel cell stack which converts fuel into electrical power. It also includes a controller which controls operation of the fuel cell system. The fuel cell system additionally includes a power link that transfers electrical power between the fuel cell system and the portable computing device, and a communication link that provides communication between the portable computing device and the controller for the fuel cell system. The controller can regulate both the electrical power provided by the fuel cell system to the portable computing device and the electrical power provided by the rechargeable battery to the fuel cell system.

Fuel cell system coupled to a portable computing device

Connectors and methods of coupling electronic devices and cables are provided. In one embodiment, a connector has a first coded magnet on a first surface of a first device. The first coded magnet has at least two different polarity regions on the first surface. A second coded magnet on a second surface of a second device is also provided. The second coded magnet is configured to provide identifying information regarding the device on which it is located.

Programmable magnetic connectors

A plug or connector including a coded magnet and an electrical contact. As the plug approaches a corresponding port, the coded magnet interacts with a magnet within the port. The interaction between the plug coded magnet and the port coded magnet provides a force to connect and/or align the plug with the port. Once the plug is received within the port, if a process is completed, the coded magnets polarities are altered to eject the plug from the port.

Growing community of inventors

Mountain View, CA, United States of America

Vijay M Iyer