Intel Corporation

Amphenol Corporation

Vijay Kasturi

Brian Kirk

Chung-Hao Chen

Bradley Alan Jackson

Ana M Yepes

Techniques and mechanisms for interconnecting circuitry disposed on a transparent substrate. In an embodiment, a multilayer circuit is bonded to the transparent substrate, the multilayer circuit including conductive traces that are variously offset at different respective levels from a side of the transparent substrate. Circuit components, such as packaged or unpackaged integrated circuit devices, are coupled each to respective input and/or output (IO) contacts of the multilayer circuit, where the conductive traces and the IO contacts interconnect the circuit components with each other. In another embodiment, the multilayer circuit is a flexible circuit that is bent to interconnect circuit components which are disposed on opposite respective sides of the transparent substrate.

Device, system and method to interconnect circuit components on a transparent substrate

An adaptor board may include a multi-layer circuit board having at least three layers, namely a first board layer, a second board layer, and a third board layer. A first plurality of cable contacts may be provided at the first board layer, and a second plurality of cable contacts may be provided at the third board layer.

Micro-coax cable adaptor board

Techniques for improving electrical performance of a connector. The techniques are compatible with the form factor of a standardized connector, such as an SFP connector or stacked SFP. The resulting connector has reduced insertion loss for high speed signals. Such techniques, which can be used separately or together, include shaping of conductive elements within the connector while still retaining the same mating contact arrangement. Changes may be made at the contact tail portions or in the intermediate portions where engagement to a connector housing occurs. The techniques also include the incorporation of lossy bridging members between conductive elements designated to be ground conductors. For connectors according to the stacked SFP configuration, multiple bridging members may be incorporated at multiple locations within the connector.

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Hillsboro, OR, United States of America

Vijay Kasturi