International Rectifier Corporation

Vijay Bolloju

Ajit Dubhashi

Mark Pavier

Bertrand Vaysse

Jorge Cerezo

Sung Hae Yea

Leigh Cormie

Sam Sundaram

A surface mounted package for semiconductor die has a lead frame with a first and elongated die pad which receives three MOSgated die spaced along its length; second, third and fourth die pads laterally spaced from the first die pad and in a row parallel to the first die pad and receiving respective MOSgated die. A central wire bond receiving pad is disposed between the first pad and the spaced second, third and fourth pads. Wire bonds then connect the die into a three phase inverter circuit. Pin connectors extend through a plastic housing covering the top of the lead frame and are connectable, with the die pads, to the surface of a PCB.

SMT three phase inverter package and lead frame

A semiconductor package that includes two semiconductor die each disposed on a respective die pad and a large tracking distance interposed between at least two leads of the package for better creepage characteristics.

Dual semiconductor die package with reverse lead form

A novel power supply control circuit topology uses a standard power supply controller to control a high side switch in an electronic circuit. A feedback voltage referenced to ground (or negative bus level) is level-shifted to a high side controller by means of a diode/capacitor/resistor network. Power to the high side controller is supplied by using the feedback output voltage. The circuit can be used instead of conventional flyback converters, particularly in low voltage applications. The circuit requires fewer pins on the transformer/inductor, leading to lower cost and size, particularly as compared to prior art flyback converters. Lower voltage rating required for the switch reduces noise and losses in the device.

Current limited buck power supply

Growing community of inventors

Cerritos, CA, United States of America

Vijay Bolloju