International Business Machines Corporation

Intel Corporation

Vijay Anand Mathiyalagan

Saravanan Sethuraman

Diyanesh B Chinnakkonda Vidyapoornachary

Kenneth Lee Wright

Prasanna Jayaraman

Gary A Tressler

Tony Emile Sawan

Robert Walter Berry, Jr

Diyanesh Babu Vidyapoornachary Chinnakkonda

Siva Rama K Pullelli

Eakambaram Rangaswamy Thirumalai

Stephen H Gunther

Sambaran Mitra

Madhusudan Chidambaram

Apparatuses, systems, and methods for bandwidth-based control of phase count in a voltage regulator. A voltage regulator may supply power to a data circuit that processes data traffic. The voltage regulator includes a plurality of phases to generate an output voltage that is provided to the data circuit. A control circuit determines a bandwidth of the data traffic that is handled by the data circuit and control a number of the phases that are active based on the determined bandwidth.

Bandwidth-based phase control of voltage regulator

Hardware and/or software that dynamically enables or disables CRC and/or adjust voltage level of power supply to a physical layer block on a host by determining an optimum tradeoff between power and performance. The hardware and/or software decreases the voltage level for the power supply and enables CRC to compensate signal errors (e.g., errors from signal integrity issues). Hardware and/or software dynamically adjusts voltage level of the power supply rail based on the throughput or speed of the DDR link. In some examples, depending on read or write operations, the voltage level of the power supply rail is adjusted.

Power and performance optimization in a memory subsystem

A scheme for measuring AC and DC load-line (LL) using voltage and current monitoring apparatus. During calibration for LL measurement, a tested or known workload is executed on a processor or system-on-chip (SoC). The calibration can be done when the processor is first used in a real-time system (customer) scenario, or repeated whenever necessary to compensate silicon aging or other effects that affect the LL values. LL is estimated, determined, and/or calculated for each power supply rail in the processor or SoC. The measured LL is used in calculations that determine the operating voltage of an input voltage regulator (VR) at run time, thereby optimizing the power/performance characteristics of that specific system.

Per-part real-time load-line measurement apparatus and method

In an example, a method of correcting an error in a memory device includes determining a temperature profile associated with a region of a memory device. The temperature profile is one of a plurality of temperature profiles each associated with a respective region of a plurality of regions of the memory device. The method includes determining a correction capability based on the thermal profile. The method also includes correcting an error in the memory region using the determined correction capability.

Correcting an error in a memory device

Systems and methods to manage a memory device by executing program code to determine a temperature profile associated with a region of the memory device. The temperature profile may be one of many temperature profiles each associated with a respective region of the memory device. A correction capability may be determined based on the thermal profile and an error in the memory region may be corrected using the determined correction capability.

Error correction based on thermal profile of flash memory device

A three-dimensional (3D) integrated circuit (IC) device can include a first die having a first supply line and a second die having a second supply line, a power header, and a voltage selection logic. The power header can be connected to the first die and the second die and configured to generate a first voltage on a first voltage line and a second voltage on a second voltage line. The voltage selection logic can be connected to the first supply line and the second supply line and configured to select between the first voltage line and the second voltage line for each of the first supply line and the second supply line.

Reconfigurable power distribution system for three-dimensional integrated circuits

An approach is provided in which a cooling manager retrieves pre-characterization data corresponding to a fan that electronic components included in a computer system. The pre-characterization data includes operational zones based upon fan power measurements and fan speed settings. The cooling manager sets the fan to a first speed setting within a first operational zone, and detects that one of the components generates a temperature change value that exceeds a specified temperature change value corresponding to the component. In turn, the cooling manager selects a second operational zone and sets the fan to a second speed setting within the second operational zone.

Thermal control system based on nonlinear zonal fan operation and optimized fan power

The present disclosure includes a three dimensional (3D) integrated device comprising a first die having a first supply line and a second die having a second supply line, a power header, and voltage selection logic. The power header is connected to the first die and the second die and configured to generate a first voltage on a first voltage line and a second voltage on a second voltage line. The voltage selection logic is connected to the first supply line and the second supply line and configured to select between the first voltage line and the second voltage line for each of the first supply line and the second supply line.

Growing community of inventors

Chennai, India

Vijay Anand Mathiyalagan