Hewlett-packard Development Company, L.p.

Hewlett-packard Company

Victoria Tsang

James J deBlanc

David Dickey

David Johannes Pommerenke

Mike T Strickler

Michal P Warzecha

A method and apparatus is provided for reducing electromagnetic radiation emissions. The method and apparatus of the present invention also reduce or prevent electromagnetic radiation generated by sources outside of a system assembly from interfering with and adversely affecting electrical circuits in the assembly. An electromagnetic compatibility (EMC) solution uses a lossy element, and/or an element comprised of a combination of lossy and conductive material.

Method and apparatus for controlling electromagnetic radiation emissions from electronic device enclosures

An electrical component having a hybrid air cooling system. The electrical component comprises an air plenum that extends across the width of the component and a first set of air movers that is positionable in a first lateral position downstream of the air plenum within the component enclosure and a second set of air movers that is positionable in a second lateral position downstream of the air plenum within the component enclosure. The first and second sets of air movers each include at least two air movers arranged adjacent each other in series. When both positioned in the component enclosure, the first and second sets of air movers are arranged in parallel such that both serial and parallel air flows are provided within the component enclosure to dissipate heat generated therein.

Electrical component having a hybrid air cooling system and method

A method and apparatus is provided for reducing or eliminating the amount of electromagnetic radiation being emitted from a system assembly comprising one or more subassemblies which comprise electrical circuits which generate electromagnetic radiation. The method and apparatus of the present invention also reduce or prevent electromagnetic radiation generated by sources outside of the system assembly from interfering with and adversely affecting the electrical circuits comprised in the subassemblies. To achieve these goals, the present invention provides an electromagnetic compatibility (EMC) solution which comprises a plurality of lossy elements, and/or elements comprised of a combination of lossy and conductive material, to reduce electromagnetic radiation. Thus, the conventional EMC solution, which utilizes conductive gaskets on system assemblies and subassemblies, and which requires adequate contact between parts in order to be effective, is replaced by the EMC solution of the present invention, which is more effective at higher frequencies and does not have stringent contact requirements.

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Davis, CA, United States of America

Victoria Tsang