Micron Technology Incorporated

Round Rock Research, LLC

Victor Wong

Jeffrey P Wright

Alan John Wilson

Timothy B Cowles

Donald M Morgan

Huy Thanh Vo

Jongtae Kwak

Hua Zheng

Joseph C Sher

William F Jones

David D Siek

Ben Ba

Nicholas Van Heel

Mehul Nagrani

Daniele Vimercati

John David Porter

Charles L Ingalls

Christopher K Morzano

Hiroshi Akamatsu

Todd D Farrell

Seth A Eichmeyer

Shizhong Mei

Nobuo Yamamoto

J Wayne Thompson

James S Cullum

Jim Cullum

Sihong Kim

Dean D Gans

Sujeet V Ayyapureddi

Simon J Lovett

Mark K Hadrick

Methods, systems, and devices for error control for memory device are described. A memory device may be configured to perform memory management operations including error control operations. For example, a memory device may be configured to perform an error control operation on data stored in a first memory cell coupled with a source row of a memory array. The memory device may be configured to write the data to a second memory cell coupled with the target row of the memory array based on performing the error control operation on the data and determine whether the management operation is complete based at least in part on the first column address of the first memory cell. The memory device may also generate an output signal to perform the error control operation on a third memory cell coupled with the source row based on determining whether the management operation is complete.

Error control for memory device

Methods, systems, and devices for temperature-based access timing for a memory device are described. In some memory devices, accessing memory cells may be associated with different operations that are variously dependent on a temperature of the memory device. For example, some operations associated with accessing a memory cell may have a longer duration and others a shorter duration depending on the temperature of the memory device. In accordance with examples as disclosed herein, a memory device may be configured for performing some portions of an access operation according to a duration that is proportional to a temperature of the memory device, and performing other portions of the access operation according to a duration that is inversely proportional to a temperature of the memory device.

Temperature-based access timing for a memory device

Semiconductor devices having modified current distribution and methods of forming the same are described herein. As an example, a memory die in contact with a logic die can be configured to draw a sum amount of current from a current source. The memory die can include a plurality of through-substrate vias (TSVs) formed in the memory die and configured to provide the sum amount of current to the memory die from the current source. The memory die can include at least two interconnection contacts associated with a first TSV closer to the current source that are not connected. The memory die can include an electrical connection between at least two interconnection contacts associated with a second TSV that is further in distance from the current source than the first TSV.

Semiconductor device with modified current distribution

Apparatuses and methods for implementing masked write commands are disclosed herein. An example apparatus may include a memory bank, a local buffer circuit, and an address control circuit. The local buffer circuit may be associated with the memory bank. The address control circuit may be coupled to the memory bank and configured to receive a command and an address associated with the command. The address control circuit may include a global buffer circuit configured to store the address. The address control circuit may further be configured to delay the command using one of a plurality of command paths based, at least in part, on a write latency and to provide the address stored in the global buffer circuit to the local buffer circuit to be stored therein.

Apparatuses and methods for implementing masked write commands

Memories, buffered write command circuits, and methods for executing memory commands in a memory. In some embodiments, read commands that are received after write commands are executed internally prior to executing the earlier received write commands. Write commands are buffered so that the commands can be executed upon completion of the later received read command. One example of a buffered write command circuit includes a write command buffer to buffer write commands and propagate buffered write commands therethrough in response to a clock signal and further includes write command buffer logic. The write command buffer logic generates an active clock signal to propagate the buffered write commands through the write command buffer for execution, suspends the active clock signal in response to receiving a read command after the write command is received, and restarts the active clock upon completion of the later received read command.

Apparatus and method for buffered write commands in a memory

Memories, systems, and methods for refreshing are provided, such as a memory with an array of memory cells divided into sections. Memories include replacement elements having a digit line, and detecting circuitry coupled to a digit line of at least one section of the memory cell array and coupled to the digit line of the replacement element. Memories include control logic configured to selectively refresh the replacement element at an occurrence when a non-neighboring section of the memory cell array relative to the replacement element is refreshed. Other memories, systems, and methods are provided.

Systems, memories, and methods for operating memory arrays

A DDR SDRAM where unidirectional row logic is associated with and connected to a single memory array instead of being associated with and connected to multiple memory arrays. The unidirectional row logic is located in the outward periphery of its associated array, but is not within a throat region between two arrays. The location of the row logic allows the throat region to include more bidirectional IO circuitry and signal lines servicing two arrays, which increases the performance of the SDRAM. In addition, separate power bussing is employed for the memory arrays and IO circuitry. This prevents noise from the arrays from affecting the IO circuitry and signal lines of the throat region and vice versa.

Memory architecture

The embodiments described herein provide memory devices. In one embodiment, a memory device includes bank control logic configured to generate a modified bank address signal and an active driver configured to provide a bank activate signal, receive an activate command signal, execute an activate command of the activate command signal at each one of a group of clock cycles, in which each one of the group of clock cycles is greater than one clock cycle, and receive the modified bank address signal, in which the modified bank address signal is high for at least a portion of each one of the group of clock cycles and the at least a portion of each one of the group of clock cycles is greater than one clock cycle.

System and method for processing signals in high speed DRAM

Methods of operating a memory device and memory devices are provided. For example, a method of operating a memory array is provided that includes a synchronous path and an asynchronous path. A Write-with-Autoprecharge signal is provided to the synchronous path, and various bank address signals are provided to the asynchronous path. In another embodiment, the initiation of the bank address signals may be provided asynchronously to the assertion of the Write-with-Autoprecharge signal.

Synchronous command-based write recovery time auto-precharge control

A method is disclosed for operating a memory device, including providing a timing signal comprising a plurality of clock cycles, providing an activate signal, and providing a bank address signal. An activate command executes on every first duration of clock cycles, and the bank address signal is high for at least a portion of the first duration of clock cycles. In one embodiment, the first duration of the activate signal is at least four clock cycles, and the bank address signal is at least one clock cycle. A memory device having a row decoder and an active driver is also provided.

Systems, memories, and methods for refreshing memory arrays

Growing community of inventors

Boise, ID, United States of America

Victor Wong