Microview Technologies Pte Ltd

Visionxtreme Pte Ltd

Emage Vision Pte. Ltd.

Saedge Vision Solutions Pte. Ltd.

Microview Technologies Ptd Ltd.

Victor Vertoprakhov

Tian Poh Yew

Soon Wei Wong

WenSen Zhou

Ah Kow Chin

Ashedah Binti Jusoh Noor

Noor Ashedah Binti Jusoh

Kundapura Parameshwara Srinivas

Wong Soon Wei

Kundapura Paremeshwara Srinivas

Choong Fatt Ho

Zhou Wensen

Chee Leong Chua

Sergey Smorgon

Wong Su Wei

An apparatus and method for measuring loop height of overlapping bonded wires, interconnecting the pads of a single or stacked silicon chips to the pads of a substrate taking the steps of: focussing of an optical assembly at multiple points of the bond wire including overlapping bond wires, capturing an image of the bond wire at each of the predetermined focused points; calculating the height of each point of the wire with respect to a reference plane; and tabulating the height data using the X, Y and Z coordinates.

Loop height measurement of overlapping bond wires

An embodiment of a method and system for inspecting clear and printed contact lenses is provided. A contact lens is inspected by illuminating the contact lens using bright-field illumination and low-angle dark-field illumination simultaneously, when the contact lens is disposed in a cavity between a male mold and a female mold. Further, the light emerging from the contact lens is received by an imaging optical system, and a camera uses the light received by the imaging optical system to capture an image of the contact lens. Further, a data processing system is configured to identify dark defects in the image that are in a first portion of a dynamic range of brightness, and to identify bright defects in the image that are in a second portion of the dynamic range of brightness.

Inspection of defects in a contact lens

There is provided an apparatus and method for inspecting a semiconductor package. The apparatus includes at least one 3D camera positioned at a first angle relative to a normal axis of the semiconductor package; and a light source configured to provide illumination for the at least one 3D camera, the light source being directed at the semiconductor package. The method includes casting a shadow of a bonded wire onto the semiconductor package; obtaining a 3D image of the semiconductor package; determining a distance S of the shadow and the bonded wire in the image; and obtaining a wire loop height H of the bonded wire.

Apparatus and method for inspecting a semiconductor package

An inspection apparatus initially involves an illuminator for directing an illuminating light beam towards a hole having two extremities and an internal surface extending between the two extremities. The inspection apparatus also involves a lens assembly for imaging the internal surface of the hole into the flat image. The lens assembly has a cylindrical field of view as well as a cylindrical depth of view. The cylindrical depth of field extends at least between the two extremities of the hole. The inspection apparatus further involves an image capturing device for capturing the flat image, and an image processing unit for performing inspection of the flat image to thereby inspect the internal surface of the hole. More specifically, the internal surface of the hole between the two extremities thereof is substantially in-focus along the flat image.

Hole inspection method and apparatus

A method of inspecting two or more sides of an object is provided. The method includes generating one set of image data of two or more sides of the object, such as by using spherical mirror segments that project all sides of the object onto a single image and generating an X by Y array of image data of the single image. The projection of the image data is then compensated for, such as by identifying inspection processes to locate defects of the object in the projected image data or by converting the image data from the projected inspection coordinates to Cartesian coordinates. Predetermined inspection processes are then performed on the compensated image data, such as by using the inspection processes that are optimized for use with the projected image data or by converting the projected image data into a Cartesian format and using Cartesian image data inspection processes.

Peripheral inspection system and method

Early techniques for object inspection relied on human inspectors to visually examine objects for defects. However, automated object inspection techniques were subsequently developed due to the labor intensive and subjective nature of human operated inspections. Additionally, object characteristics such as object power and object thickness need to be determined after the objects have been examined for defects. Conventionally, corresponding inspection stations are along the manufacturing lines for determining each of the object characteristics. However, the need for human intervention and time spent to move the objects from one inspection station to another adversely affect the efficiency of the object manufacturing process. An embodiment of the invention disclosed describes a high-resolution object inspection system for performing object inspection.

Object inspection system

An embodiment of a system and a method for inspecting a contact lens is provided. The illumination system illuminates the center zone and the peripheral zone of the contact lens when it is inside a cavity between a male mold and a female mold. The imaging optical system has two channels to capture two images or a composite single image to inspect the entire contact lens. The imaging optical system of the first channel has its entrance pupil far away from the mold tool. The camera of the first channel is used to capture the image of the center zone of the contact lens. The image optical system of the second channel is located outside the mold tool but its entrance pupil is located inside the mold tool or outside but substantially close to it. This enables the camera of the second channel to capture the image of the peripheral zone of the contact lens.

Method and apparatus for inspecting ophthalmic lens

A system for generating high resolution image data using a low resolution image sensor is provided. The system includes an image sensor array and an image size system determining a pixel resolution area. An image target system determines a desired pixel resolution area, and an image sensor array placement system determines two or more locations for an image sensor array based on the pixel resolution area and the desired pixel resolution area. An image composition system receives first image data of a target from the image sensor array at a first location and second image data of the target from the image sensor array at a second location and combines the first image data and the second image data to form composite image data having an effective pixel resolution area less than the pixel resolution area.

Image resolution multiplier

An inspection system is provided. The system includes a rotating prism having a first end and a second end. The first end receives a first image area, such as a circular view, and rotates about a center point so as to cover a field of view area that is larger than the first image area, such as a larger circle that is defined by the smaller circle of view as it rotates around the center point. The second end remains centered on the center point and provides a viewing area that does not change in dimension. An image data system at the second end of the rotating prism generates image data as the prism rotates so as to generate two or more sets of image data that are contained within the field of view area.

Rotating prism component inspection system

A method of optically inspecting a fastener to determine whether it meets two or more dimensional parameters is provided. The method includes using centrifugal force to place the fastener in a predetermined location. Two or more sets of image data of the fastener are generated from two or more corresponding different angles. Fastener pass/fail data is generated using a dimensional requirement associated with each set of image data.

Fastener inspection system and method

A system for high-speed inspection is provided. The system includes a digital camera focused on an inspection location and generating image data. An array of light emitting diodes generates light beams, and one or two lenses collimate the light beams. The angle of incidence of the collimated light on an item at the inspection location is greater than approximately 50 degrees, such as to avoid flashing which can be created by coating on the inspection item or other surface effects. The collimating lenses have a center hole and the digital camera is focused on the inspection location through the center hole.

Growing community of inventors

Novosibirsk, Russia

Victor Vertoprakhov