Sun Microsystems, Inc.

Cisco Technology, Inc.

Pensando Systems Inc.

Victor Odisho

Ali Hassanzadeh

Russell N Mirov

Luca Cafiero

Bidyut Kanti Sen

Francisco M Matus

Zhiping Yang

Lin Shen

Jayaprakash Balachandran

Michael Leung

Described herein are baffles for Input/Output (I/O) devices and I/O devices comprising baffles configured to redirect incoming pre-heated air around downstream electrical components and/or their respective heat sinks to prevent overheating. Providing an isolated fresh airflow path from a fluid inlet to such downstream electrical devices reducing such overheating, which prevents malfunctions and increases the I/O efficiency, speed, and lifetime of I/O devices.

Methods and systems for thermal control

An embodiment includes a first server including a first processor electrically connected to a second processor; a second server including a third processor electrically connected to a fourth processor; a first connection plane, wherein one of the first and second processors is connected to one of the third and fourth processors by a first connection via the first connection plane and one of the first and second processors is connected to one of the third and fourth processors by a second connection via the first connection plane; and a second connection plane, wherein one of the first and second processors is connected to one of the third and fourth processors by a third connection via the second connection plane and wherein one of the first and second processors is connected to one of the third and fourth processors by a fourth connection via the second connection plane.

Interconnect method for implementing scale-up servers

A small form-factor pluggable (SFP) module includes a board with an end portion to be inserted into a connector device. A first set of signal pads is arranged along an edge of a first surface of the SFP board at the end portion and a second set of signal pads along an edge of a second surface of the SFP board at the end portion. A third set of signal pads is disposed on the second surface at the end portion, offset from the edge of the second surface. A transceiver, coupled to the signal pads of the first, second, and third sets of signal pads, is configured to transmit and receive signals via the third set of signal pads and to transmit and receive signals via at least one of the first and second sets of signal pads.

Optical module design in an SFP form factor to support increased rates of data transmission

A memory module with offset notches for improved insertion and a memory module connector for mating thereto. The connector housing includes an accommodating s space for receiving a portion of the memory module printed circuit board (PCB). A first key is disposed within the accommodating space of the housing and is positioned between the first end and the center of the housing. A second key is flirter disposed within the accommodating space and is positioned between the second end of the housing and the center. A distance between the first key and the second key is greater than 40% of the length of the housing. Either the first, second, or both keys may extend from the accommodating space beyond a top plane defined by a top side of the accommodating space of the housing. The memory module comprises the PCB with a first notch positioned between the first end of the PCB and the center of the PCB. A second notch is positioned between the second end of the PCB and the center of the PCB. A distance between the first notch and the second notch is greater than 40% of the length of the PCB. The first notch may be farther from the first end of the PCB than from the center, and the second notch may be closer to the second end of the PCB than to the center.

Memory module with offset notches for improved insertion and stability and memory module connector

A memory module with offset notches for improved insertion and a memory module connector for mating thereto. The connector housing includes an accommodating space for receiving a portion of the memory module printed circuit board (PCB). A first key is disposed within the accommodating space of the housing and is positioned between the first end and the center of the housing. A second key is further disposed within the accommodating space and is positioned between the second end of the housing and the center. A distance between the first key and the second key is greater than 40% of the length of the housing. Either the first, second, or both keys may extend from the accommodating space beyond a top plane defined by a top side of the accommodating space of the housing. The memory module comprises the PCB with a first notch positioned between the first end of the PCB and the center of the PCB. A second notch is positioned between the second end of the PCB and the center of the PCB. A distance between the first notch and the second notch is greater than 40% of the length of the PCB. The first notch may be farther from the first end of the PCB than from the center, and the second notch may be closer to the second end of the PCB than to the center.

A memory module with offset notches for improved insertion and a memory module connector for mating thereto. The connector housing includes an accommodating space for receiving a portion of the memory module printed circuit board (PCB). A first key is disposed within the accommodating space of the housing and is positioned between the first end and the center of the housing. A second key is further disposed within the accommodating space and is positioned between the second end of the housing and the center. A distance between the first key and the second key is greater than 40% of the length of the housing for stability of the memory module while encased by the housing. Either the first, second, or both keys may extend from the accommodating space beyond a top plane defined by a top side of the accommodating space of the housing. The memory module comprises the PCB with a first notch positioned between the first end of the PCB and the center of the PCB. A second notch is positioned between the second end of the PCB and the center of the PCB. A distance between the first notch and the second notch is greater than 40% of the length of the PCB. The first notch may be farther from the first end of the PCB than from the center, and the second notch may be closer to the second end of the PCB than to the center.

An identification interface that transfers control information between a controller and an option module coupled to a motherboard of a computer. The identification interface supports the propagation of a plurality of bit fields containing information pertaining to the characteristics of the option module including, but not limited to, its speed, type and other information about its characteristics.

Identification interface

A component card interconnect apparatus for coupling a component card to a computer system. A component card includes a first group of in-line pins with first power pins for conveying a first voltage and a second group of in-line pins with second power pins for conveying a second voltage. The second voltage is lower than the first voltage. Either the first or the second voltage is conveyed at one time.

Growing community of inventors

San Jose, CA, United States of America

Victor Odisho