Digital Equipment Corporation

Other

The Boeing Company

Aavid Laboratories, Inc.

Victor M Samarov

George A Doumani

William J Pauplis

Igor Nikolaevich Troitski

Ralph I Larson

Roman Haykin

Dmitry Seliverstov

Eugene Kratt

George A Doumani, Jr

Evgeny Khomiakov

Jeffrey Michael Lewis

Clifford C Bampton

Margaret L Hetfield

Richard J Phillips

John C Killian, Jr

Zeljko Arbanas

Glenn Richard Skutt

Raoji Patel

David E Boudreau

Stanley J Jaskiel, Jr

Gerald J Piche

Joseph A DeCarolis

Lawrence Guzowski

Philip F Becker

Hewon Hwang

Steve W Norris

Method and system for manufacturing multi-component complex shape parts consisting of monolithic and powder materials working at different performance conditions based on hot isostatic pressing of the monolithic elements and powder material including preliminary heat treatment of the said monolithic elements of the multi-component part wherein they are a subject to high temperature solution treatment at elevated isostatic gas pressure followed by quenching in order to homogenize their material, to dissolve residual cast eutectic and to provide the micro-structure and the properties insensitive and steady during the subsequent HIP and heat treatment of the powder material.

Method and system for manufacturing of multi-component complex shape parts consisting of monolithic and powder materials working at different performance conditions

Method for manufacturing complex shape parts including parts with cavities from powder materials by Hot Isostatic Pressing (HIP) with controlled pressure inside the HIP tooling and multi-layer inserts including hollow inserts. Controlled pressure inside the HIP tooling is provided by injecting the HIP gas media into the cavities of the hollow inserts.

Method and system for manufacturing of complex shape parts from powder materials by hot isostatic pressing with controlled pressure inside the tooling and providing the shape of the part by multi-layer inserts

A method for manufacturing a net-shaped bimetallic part that includes the steps of: providing a tool that defines a cavity and a tooling surface; depositing a layer of an environmental metal material onto the tooling surface; filling the cavity in the tool with a powdered metal material; and simultaneously heating the tool and subjecting the tool to a pressurized gas to consolidate the powdered metal material and diffusion bond the environmental metal material to the consolidated powdered metal material to form a bimetallic part.

Method of manufacturing net-shaped bimetallic parts

A method and apparatus for molding a video display screen bezel to a video display device, such as a CRT, is disclosed. The bezel is molded in such a way as to eliminate the need for fasteners between the bezel and the CRT and between the bezel and a housing or some other structural support. The molded bezel also prevents any undesirable shifting of the CRT with respect to the bezel due to accidental dynamic loads. The molding material conforms to the surface of the CRT compensating for any dimensional variations in the CRT while minimizing the size of the bezel. Molded within the bezel is a compensating means which absorbs stresses generated by the molding material both during and following the molding process which might otherwise be exerted on the CRT.

Molded video display screen bezel

A liquid crystal (LC) display monitor has a high luminosity light source to provide good visibility in brightly lit areas. To prevent overheating of the LC screen and other components of the monitor, a two-phase cooler is provided. The cooler consists of two translucent, flexible bag-like containers, each conforming to a different side of the light source. A low-boiling point coolant within the containers absorbs heat from the light source and is partially vaporized. The coolant vapor travels from the containers into a condenser which is external to the monitor cabinet. The condenser draws thermal energy out of the coolant vapor, causing it to condense and return to the containers. The containers provide shock absorption to protect the light source, and the containers or the coolant may have light-scattering properties to provide diffusion of the light. Other alternatives include locating the light source within the containers or placing the container in contact with the LC screen rather than with the light source.

Light source cooler for LCD monitor

This invention relates to a method by which an electrical interconnect device is manufactured. In the preferred embodiment of the invention, the geometric dimensions of the device and its necessary electrical characteristics are determined by reference to the components which the device is going to interconnect. An electrically conductive skin thickness, which will achieve the necessary electrical requirements of the application, is also determined. That conductive skin is then selectively formed over an electrically non-conductive core, which is constructed in accordance with the geometric requirements and electrical operating properties of the application, but which is deliberately undersized by the thickness of the skin. Thus, when the skin is formed over the undersized core, the skin thickness causes the final device produced by the process to meet both the electrical and geometric requirements of the application.

Method of making an electrical interconnect device

A system for cooling an electronic module in a computer system. In one embodiment of the invention, predetermined areas of the module, such as those exposed parts that carry electrical currents are covered with an conformable, electrically insulating layer. Thereafter, a second conformable, thermally conductive layer is formed on the first layer. In addition, surface expanding elements may be arranged on the first layer near devices particularly sensitive to heat before the application of the second layer.

Conformal heat sink for electronic module

There is provided a method and materials for cooling the power train components, such as transformers, rectifiers, chokes, and the like, of an integrated on-board power supply IOP) using a single heatsink. Spacers are positioned between the power train components and a substrate, the substrate for mounting the components. The spacers are individually dimensioned and shaped to raise the heat-removal surfaces of the components to a substantially uniform and minimal height. A heatsink having a substantially planar, heat-acquiring surface is positioned on the heat-removal surfaces of the power train components. Fasteners are used to compress the spacers, urging the components against the heatsink to provide a substantially continuous and coplanar thermal interface between the components and the heatsink. After the components, heat sink and substrate have been fastened to each other, the components are electrically connected to the substrate by soldering.

Coplanar heatsink and electronics assembly

A shock and vibration isolating device is provided for mounting a component on a supporting structure while absorbing with substantially equalized reaction force relative movement between the component and the supporting structure occurring in all of the three mutually orthogonal planes in which the dynamic loading of the component can occur. The device includes an open frame planar spring element lying in a plane parallel to one of the mutually orthogonal planes, the spring element composed of a core member of a low creep, high modulus, metal and a shell member of a plastic exhibiting high internal dynamic loss substantially encompassing said core. A first cantilever section adjacent a first end is mounted to the supporting structure; a second cantilever section parallel to the first cantilever section adjacent a second end is mounted to the component; and a bridge section connects the first and second cantilever sections and is perpendicular thereto. The ratio of the lengths of the first cantilever section to the second cantilever section to the bridge section is substantially 1.84:1.09:1.00.

Uniform spatial action shock mount

In the manufacture of flat-panel video displays, an assembler must align long rows of closely-spaced electrical signal contacts on a planar electroluminescent panel with mating signal contacts on a flex circuit prior to clamping the panel and flex circuit together. The disclosed technique employs electrically conductive alignment contacts on both surfaces. The alignment contacts are formed via the same process that forms the signal contacts. The alignment contacts are connected to ohmmeters to form circuits that an assembler monitors to determine proper alignment of the surfaces. The use of electrical rather than visual alignment checking makes assembly easy and error-resistant.

Planar interconnect with electrical alignment indicator

This invention relates to a heat dissipation apparatus for cooling a number of heat generating electrical components mounted on a printed circuit board, some of which components are arranged in pairs, each pair being separated by a space. The apparatus includes two heatsinks positioned such that the parallel, thermally conductive walls of the heatsinks are adjacent to the heat transfer surfaces of the components. Disposed within the space separating a given component pair is a pressing fastener which has a yoke with a V-shaped recess into which is positioned a wedge. The positioning of the wedge in the recess is adjusted by means of a screw, resulting in the tines of the yoke spreading as the wedge is drawn within the recess. As the tines spread, they engage the paired components pressing them in contact with the heatsink walls. Finally, as the screw is tightened, it compresses a Belleville spring which thereafter continues to apply a force on the screw, tending to urge the wedge within the recess and thereby keeping the components in pressed contact with the heatsink.

Heat dissipation apparatus

An arcuate profiled heatsink is disclosed, over which is flexed and attached a substrate on which are mounted heat producing, temperature sensitive electronic devices. Flexing the substrate to conform with the arcuate surface of the heatsink minimizes air pockets between the two, which would ordinarily result due to warpage resulting from the fabrication of the substrate. The interface between heatsink and substrate, therefore, has lower thermal resistance, thus, increasing thermal conductivity between heatsink and substrate, and increasing the amount of heat dissipated by the heatsink. Because no hard joining of the two parts is required, they may be separated for repair, and stress resulting from thermal expansion mismatch will not be transferred to the substrate.

Arcuate profiled heatsink apparatus and method

A triaxially-equalized action shock and vibration-insulation mount is provided for the protection of a dynamic load-sensitive component, such as a mass-storage device, from external multidirectional dynamic loads above a predetermined magnitude. A substantially uniform, attenuated response of the component to such dynamic loads is the result, regardless of the direction of application of the loads. In order to achieve substantially uniform reactions to such external loads applied along any of the three orthogonal spatial axes, and further in order to achieve higher structural integrity of the mount by reducing flexural, tensile and/or shear stresses, the shock mount comprises a body of elastic, preferably foamed elastomer material, which is confined at its periphery in a rigid, stationary shell, substantially symmetrical relative to the orthogonal spatial axes and partially open at one side. The elastic material body is shaped at its geometrical center to provide a tight, e.g., spherical, socket for an enlarged symmetrical, e.g. spherical, end portion of a rigid rod extending outward from said socket, through the partially open side of the shell, into rigid connection with the load-sensitive component. The elastic material of the body is stressed primarily in compression along each of its axes. The elastomeric material may alternatively be constituted by a plurality of relatively small-diameter tightly randomly packed, solid elastic spheres.

Triaxially-equalized action shock mount

A cooling apparatus for a substrate with heat generating circuit devices mounted on a first side thereof. A second side of the substrate is coated with a first layer made of a releasing agent. A second layer made of a thermally conductive material having a low melting point is provided on the first layer. A heat sink is provided on the second layer, for radiating heat transmitted from the circuit device through the substrate, the first layer and the second layer. During the assembly, the apparatus is heated and compressed to reflow the second layer reducing any air pocket formed at the substrate-to-heatsink interface.

Substrate to heatsink interface apparatus and method

A cathode ray tube mounting apparatus and method for use in a video display terminal or television receiver. An adhesive is applied to either the inside perimeter of the bezel of the cabinet or to the perimeter of the front surface of the cathode ray tube. The cathode ray tube and bezel are then placed in contact and pressed together. Before the adhesive has set, the position of the cathode ray tube is adjusted to align the cathode ray tube with the horizontal center line of the cabinet. In another embodiment, a sheet of material is attached to the inside of the front portion of the cabinet. The adhesive is applied to either the sheet of material or to the front surface of the cathode ray tube. The cathode ray tube and front portion of the cabinet are then mated as before. The sheet of material is used to compensate for any thermoexpansion mismatch between the cathode ray tube and the cabinet.

Growing community of inventors

Carlisle, MA, United States of America

Victor M Samarov