Wafergen, Inc.

Takara Bio Usa, Inc.

Hewlett-packard Company

Hewlett-packard Development Company, L.p.

Avrio Technologies, Inc.

Victor Joseph

Alnoor Shivji

Amjad Huda

Jie Zhou

Ravi Ramaswami

Daniel A Kearl

Martha A Truninger

Colin C Davis

Roberto A Pugliese

Ronald L Enck

Ronnie Yenchik

Min Cao

Theodore I Kamins

John P Whitlock

Lei Zhang

Khalid Ahmad

Anil Prem

Apparatus, systems, chips, and methods of performing a large number of simultaneous chemical reactions are provided herein. The chips of the invention comprise addressable units that can be addressed according to the temperature of the reaction to be run. The subject apparatus, systems, and chips are particularly suited for performing polymerase chain reactions on thousands of nucleic acid sequences, up to and including sequences of an entire genuine of an organism of interest.

Apparatus for high throughput chemical reactions

The present invention provides miniaturized instruments for conducting chemical reactions where control of the reaction temperature is desired or required. Specifically, this invention provides chips and optical systems for performing and monitoring temperature-dependent chemical reactions. The apparatus and methods embodied in the present invention are particularly useful for high-throughput and low-cost amplification of nucleic acids.

Thermo-controllable high-density chips for multiplex analyses

Apparatus, systems, chips, and methods of performing a large number of simultaneous chemical reactions are provided herein. The chips of the invention comprise addressable units that can be addressed according to the temperature of the reaction to be run. The subject apparatus, systems, and chips are particularly suited for performing polymerase chain reactions on thousands of nucleic acid sequences, up to and including sequences of an entire genome of an organism of interest.

Apparatus and method for multiplex analysis

Thermo-controllable chips for multiplex analyses

Methods of sealing micro wells

A process for fabricating a droplet plate for the printhead of an ink-jet printer, which process provides design flexibility, precise dimension control, as well as material robustness. Also provided is a droplet plate fabricated in accord with the process.

Droplet plate architecture

The optical switch of the present invention advantageously comprises a three dimensional architecture capable of taking input optical signals launched in a first direction, deflecting the signals in a second direction and again in a third direction, preferably orthogonal to the first direction, with no moving parts. The signals are collected at an elevated level without passing through additional nodes. Preferably, incoming beams migrating in an x-direction along a bottom layer are steered in a z-direction to an elevated layer comprising sloped stepped mirror surfaces or a parabolic mirror surface. In an alternate embodiment, a wave guide based optical switch advantageously steers input optical signals from a bottom wave guide layer to an elevated wave guide layer via vertical coupling. The beams are then merged into a collection channel and directly coupled into output fibers without passing through additional transition or cross nodes. In another alternate embodiment, an optical switch include two identical functional plates comprising an array of identically sized and shaped transmissive blocks with stationary inclined electro-optic reflective surfaces.

3-D electro optical switch

Droplet plate architecture in ink-jet printheads

A highly-efficient thermal inkjet printhead. The printhead includes a primary layer of polycrystalline silicon (preferably doped) having at least one portion thereof which functions as an ink expulsion resistor. Positioned over and above the primary layer is a secondary layer of material having at least one section produced from a selected metal silicide compound and at least another section fabricated from undoped polycrystalline silicon. The metal silicide-containing section functions as an interconnect structure and is operatively connected to the resistor in the primary layer (which is positioned beneath the secondary layer). The undoped polycrystalline silicon section is at least partially aligned over and above the resistor. As a result, the resistor is &ldquo;buried&rdquo; beneath the secondary layer and the various portions thereof. This system provides improved reliability, greater dimensional simplicity, optimized electrical/thermal properties, and superior versatility.

Thermal inkjet printhead and high-efficiency polycrystalline silicon resistor system for use therein

Growing community of inventors

Fremont, CA, United States of America

Victor Joseph