Applied Materials, Inc.

Victor H Calderon

Muhammad M Rasheed

Avgerinos V Gelatos

Valentin Nikolov Todorow

Yu Lei

Martin Jeffrey Salinas

Muhannad Mustafa

Vikash Banthia

Aniruddha Pal

Shi Wei Toh

Yung-Hsin Lee

Anindita Sen

Methods and apparatus for processing substrates are provided herein. In some embodiments, a process kit for a substrate support includes: an upper edge ring made of quartz and having an upper surface and a lower surface, wherein the upper surface is substantially planar and the lower surface includes a stepped lower surface to define a radially outermost portion and a radially innermost portion of the upper edge ring.

Process kit for a substrate support

Embodiments of the invention generally provide a cooling mechanism utilized in a plasma reactor that may provide efficient temperature control during a plasma process. In one embodiment, a cooling mechanism disposed in a plasma processing apparatus includes a coil antenna enclosure formed in a processing chamber, a coil antenna assembly disposed in the coil antenna enclosure, a plurality of air circulating elements disposed in the coil antenna enclosure adjacent to the coil antenna assembly, and a baffle plate disposed in the coil antenna enclosure below and adjacent to the coil antenna assembly.

Cooling mechanism utilized in a plasma reactor with enhanced temperature regulation

Cooling mechanism utlized in a plasma reactor with enhanced temperature regulation

Growing community of inventors

Sunnyvale, CA, United States of America

Victor H Calderon