Vichem Corporation

Other

Gel Pak L.l.c.

Victor E Althouse

Christopher E Brodie

Bruce J Benjamin

A carrier tape for electronic or electrical devices which contains a support film containing pockets. The floor of each pocket has been weakened, for example, by means of slits, so that it can be easily deformed. A device is releasably attached to a fastening member in the pocket, for example to a layer of a PSA or an elastomer on the floor of the pocket. When a deforming force is applied to the floor of the pocket, the floor deforms and separates the device from the fastening member, making it easy to remove from the pocket.

Tape carrier for electronic and electrical parts

A carrier tape for electronic or electrical devices which contains a support film containing pockets and, within each of the pockets, a fastening layer having a fixed portion which is attached to the floor of the pocket and a release portion which is composed of a flexible polymeric film, preferably a soft elastomer film, and which can be deformed away from the floor without detaching the fixed portion from the floor. The devices are placed on the release portions of the fastening member.

A carrier tape for electronic or electrical devices which contains a pocketless support film, a fastening layer on the support film, and a deformable cover film separably attached to the fastening layer. The devices are sandwiched between the fastening layer and the cover film, which deforms to provide an enclosure for the devices.

Method and apparatus for handling semiconductor chips and the like are disclosed which include the use of a flat flexible film which is attached to the face of a base member. The face of the base member is formed with recesses covered by the flat flexible film. Chips are loaded onto the flat flexible film in good surface contact therewith whereby they are securely held in position by interfacial, adhesive, or other forces between the chips and film. To facilitate removal of chips from the film, the recesses are connected to a vaccuum source, drawing portions of the flexible film into said recesses and providing the film with a texturized, or undulating, surface. The area of contact between the chips and film is thereby reduced which, in turn, results in a reduction in the force by which the chips are attached to the film, thereby enabling removal of the chips by conventional techniques.

Method and means for handling semiconductor and similar electronic

Method for handling semiconductor chips and the like objects are disclosed which include the use of a flat flexible film that is supported on a flat porous texturized fabric sheet such as a woven or knit fabric having spaced fiber crossovers. Objects, are supported on the flat flexible film in intimate surface contact therewith for securely holding the same in position by interfacial forces therebetween. Adhesive may be included for increasing the interfacial force. To facilitate removal of objects from the film, the fabric is connected to a vacuum source for drawing portions of the flexible film over and between crossovers in the fabric whereby portions of the flexible sheet are withdrawn from the objects. The contact area and interfacial forces between the flexible sheet and objects is thereby reduced to enable removal of the objects from the sheet using conventional object handling techniques.

Method for handling semiconductor die and the like

Apparatus for handling semiconductor chips and the like objects are disclosed which include the use of a flat flexible film that is supported on a flat porous texturized fabric sheet such as a woven or knit fabric having spaced fiber crossovers. Objects, are supported on the flat flexible film in intimate surface contact therewith for securely holding the same in position by interfacial forces therebetween. Adhesive may be included for increasing the interfacial force. To facilitate removal of objects from the film, the fabric is connected to a vacuum source for drawing portions of the flexible film over and between crossovers in the fabric whereby portions of the flexible sheet are withdrawn from the objects. The contact area and interfacial forces between the flexible sheet and objects is thereby reduced to enable removal of the objects from the sheet using conventional object handling techniques.

Means for handling semiconductor die and the like

Semiconductor wafer and die handling method and means are disclosed which include use of a rigid substrate and attached compliant elastomer layer. The outer face of the elastomer layer is texturized to reduce the interfacial forces between said layer and semiconductors supported thereon sufficiently to allow for removal of the semiconductors by conventional means. Friction forces between the texturized layer and semiconductors and remaining interfacial forces are sufficiently high to prevent undesired movement of semiconductors relative to the supporting layer during handling. The elastomer layer may be bonded to the substrate, or attached thereto by interfacial forces between smooth abutting substrate and elastomer layer surfaces. Among other things, the compliant elastomer layer may be included in the construction of a shipping container for semiconductor chips, wafers, or the like. Texturization of the elastomer surface may be provided by molding using a mold with a texturized surface.

Growing community of inventors

Los Altos, CA, United States of America

Victor E Althouse