Delco Electronics Corporation

Raytheon Company

Victor David Kruppa

Raymond Lippmann

James Edward Nelson

Michael J Schnars

Ronald Kenneth Selby

Richard A Schmidt

Gail M Sylvester

David Alan Ross

Mark James Miller

Robert Ray Voltenburg, Jr

Maurice Lydell Dantzler

Gerard Arnold Streelman

Embodiments of a system to maintain an even temperature distribution across a laser detector are generally described herein. In some embodiments, the system includes a multi-layer printed circuit board (PCB) assembly that includes a first layer comprising a thermally-conductive ring provided circumferentially around a thermally-conductive detector region for mounting the laser detector, a second layer comprising a plurality of resistive elements aligned with the thermally-conductive detector region to generate heat, and a fourth layer comprising a thermally-conductive heat-distribution region aligned with the thermally-conductive detector region. A plurality of thermally-conductive vias is provided to couple the thermally-conductive ring of the first layer to the thermally-conductive heat-distribution region of the fourth layer. The thermally-conductive vias transfer heat between the thermally-conductive heat-distribution region and the thermally-conductive ring to provide an even distribution of heat across the laser detector.

System for maintaining an even temperature distribution across a laser detector

In a preferred embodiment, a through hole connector pin for a circular through hole defined through a printed circuit board substrate, including: a vertical cylindrical portion of the connector pin for insertion in the circular through hole, the vertical cylindrical portion having a diameter less than that of the circular through hole; and a horizontal offset head portion of the connector pin formed integrally with the vertical cylindrical portion, the horizontal offset head portion having a shape approximating that of a conductive pad disposed on an upper surface of the printed circuit board substrate.

Through hole circuit board interconnect

A coil is wound on a bobbin having posts extending from the bobbin body, the end of the coil wire being wrapped on the posts to form wire terminations. The coil is mounted on a circuit board with the coil either above the board or suspended alongside the board edge. The periphery of each post is positioned against a solder pad of the circuit board and the wire termination is soldered to the pad. Each post has a flexible neck portion to relieve stress due to coil thermal expansion. A recess in the side of the post facing the solder pad enhances solder interaction with the wire termination.

Surface mount coil assembly

An elastomeric connector couples the terminal pads of an LCD with corresponding terminal pads of a printed wiring board (PWB). Conductive elements in the connector are subject to skewing at such an angle that the LCD must be adjusted relative to the PWB to attain pad alignment. Sense pads on the terminal strips are coupled to contact pads and are arranged so that a continuity test on substantially opposed contact pads will verify pad alignment. In one embodiment, one sense pad is narrower than the terminal pads so that even marginal continuity will assure proper alignment of the terminal pads. In another embodiment, a pair of sense pads on either one of the LCD and the PWB is bracketed by a pair of spaced pads on the other such that continuity is evidence of non-alignment.

LCD connector alignment with printed wiring board

A package is provided for connecting a plurality of molded carriers each having an integrated circuit which has been previously bonded to the electrical leads of a TAB tape. The package flexibly and sequentially connects a plurality of the carriers, so as to form a flexible and continuous chain of the carriers. The package preferably utilizes a flexible conductive tape which is continuously provided on parallel ends, or edges, of each carrier, so as to link the plurality of carriers together. The package permits continuous feeding of the carriers into subsequent test and assembly machines utilized to attach the integrated circuit to a printed circuit board.

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Tucson, AZ, United States of America

Victor David Kruppa