Tandem Computers Incorporated

Victor D Trujillo

Joerg U Ferchau

Hoa V Pham

Randall J Diaz

Robert E Smith

Josonando Joson

A packaging system for components of a computing system includes an external, modularized, ecto-skeletal support frame for supporting a plurality of uniformly, horizontally dimensioned cabinets in stacked arrangement. The support frame is formed from a plurality of support shelves that form the support platforms for the cabinets. Separating and support shelves are support sleeves, that can be of variable lengths in order to accommodate the varying vertical dimensions of the cabinets held by the support frame.

Packaging system

A high density electronic module packaging system includes a cabinet for housing a plurality of modules. Disposed at the rear of the cabinet and forming a rear wall thereof is a cooling system housing that is used for cooling the modules contained in the cabinet Disposed within the cabinet are a plurality, e.g., four, cooling modules; a power distribution unit having a plurality, e.g., twelve, power converters; and a plurality, e.g., twenty-eight electronic modules. The number of cooling modules, power converters and electronic modules may be added or subtracted as needed or desired. The cooling modules flow cooling fluid to and/or from the power distribution unit and/or to the plurality of electronic modules. The power distribution unit supplies power to the plurality of electronic modules. The electronic modules may house one or more submodules such as storage devices (e.g., disk drives) or printed circuit boards.

Modular power supply arrangement with cooling

A high density electronic module packaging system includes a cabinet for housing a plurality of modules. Disposed at the rear of the cabinet and forming a rear wall thereof is a cooling system housing that is used for cooling the modules contained in the cabinet. Disposed within the cabinet are a plurality, e.g., four, cooling modules; a power distribution unit having a plurality, e.g., twelve, power converters; and a plurality, e.g., twenty-eight electronic modules. The number of cooling modules, power converters and electronic modules may be added or subtracted as needed or desired. The cooling modules flow cooling fluid to and/or from the power distribution unit and/or to the plurality of electronic modules. The power distribution unit supplies power to the plurality of electronic modules. The electronic modules may house one or more submodules such as storage devices (e.g., disk drives) or printed circuit boards.

Apparatus for cooling a plurality of electronic modules

Method and apparatus for mounting, cooling, interconnecting, and

A storage unit for an array of modular assemblies, such as disk drives, includes a cabinet having an array of rectangular cavities open toward the front, each for receiving an assembly carrier drawer. Each carrier drawer has electrical connections for receiving an electrical assembly in the drawer. The rear of each drawer has an electrical connection panel for mating a receiving panel connected to the inside back of the cabinet, and associated with the electrical connection panels are pin-and-aperture locating and registering means for precisely aligning the carrier drawer for proper mating electrical contact with the back of the cabinet automatically as the carrier drawer is pushed fully into the cabinet. This enables disk drive maintenance to be performed quickly and efficiently by pulling out a carrier drawer and inspecting, repairing or replacing the modular assembly.

Growing community of inventors

Fremont, CA, United States of America

Victor D Trujillo