International Business Machines Corporation

Victor A Stankevich

Challis Llewellyn Purrington

Michael Leo Scollard

Ivan R Zapata

Henry Gaines McMillan

Brian A Baker

Paul Douglas Bashor

Methods, apparatus, and products are disclosed for preemptive thermal management for a computing system based on cache performance, the computing system having a processor, cached computer memory operatively coupled to the processor, and a processor cache operatively coupled to the processor, the processor cache capable of storing a subset of memory contents of the cached computer memory, that include: attempting, by the processor, to retrieve portions of the memory contents of the cached computer memory from the processor cache, resulting in cache misses for the processor cache; tracking, by the processor, cache miss statistics for the processor cache in the computing system, the cache miss statistics describing the cache misses for the processor cache; and administering a thermal management device for the computing system in dependence upon the cache miss statistics, the thermal management device operatively coupled to the processor and capable of managing temperature for the computing system.

Preemptive thermal management for a computing system based on cache performance

An embodiment of the present invention is directed to a memory module connector having a pivotable air baffle that controls airflow at the memory module connector. When the memory module connector is occupied by a memory module, the air baffle may rest on an upper edge of the memory module, substantially parallel to the system board and in general alignment with the airflow. When the memory module has been removed, the air baffle may be pivoted downward toward the connector base and into the airflow, to offset the reduction in airflow impedance caused by the removal of the memory module from the memory module connector.

DIMM connector and memory system with compensated airflow impedance

Detecting, predicting, and diagnosing faults in a cooling system. According to one embodiment, a heat sink is in thermal contact with a heat-generating electronic component. When a temperature differential between the electronic component and the heat sink exceeds a set point, a fault signal is generated. The set point may be empirically or theoretically determined. The set point may be a static set point, or it may be a dynamic set point determined according to real-time operational parameters of the system. The system may be implemented with predictive failure analysis (PFA) to provide a more reliable, efficient, inexpensive, and robust computer system.

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Cary, NC, United States of America

Victor A Stankevich