Hewlett-packard Development Company, L.P.

Vicki L Smith

Richard A Schumacher

Brian Matthew Johnson

John A Nerl

Michael C Day

June E Goodwin

Rajakrishnan Radjassamy

Ronald J Bellomlo

A memory module according to one implementation includes a support substrate, plural memory devices mounted on the support substrate, and pins having a predetermined arrangement on the support substrate, the pins comprising signal pins connected to the memory devices, power pins, and ground pins. In the predetermined arrangement of pins, each signal pin uses a ground pin as a reference, and each power pin is adjacent a ground pin for reduced impedance between the power pin and ground pin. In some implementations, some of the signal pins are associated with redundant pins.

Memory module with a predetermined arrangement of pins

One memory module includes a printed circuit board comprising an upper row of memory integrated circuits, a lower row of memory integrated circuits, and a first addressing register and a second addressing register, the first addressing register and a second addressing register each having at least one of address and control input routing primarily provided in a first layer, the first addressing register coupled to the upper row of memory integrated circuits and the second addressing register coupled to the lower row of memory integrated circuits.

Double-high DIMM with dual registers and related methods

Growing community of inventors

NW Province, Cameroon

Vicki L Smith