Gm Global Technolgoy Operations, Inc.

Vicentiu Grosu

Gregory S Smith

David Yuang Tang

Mark D Korich

Konstantinos Triantos

Khiet Le

Yunqi Zheng

Gregory D Rosdahl

A power electronic building block includes a housing; a power module mounted within the housing; a controller mounted within the housing and coupled to the power module; a capacitor assembly coupled to the power module and mounted within the housing; an AC bus bar mounted within the housing; and a DC bus bar coupling the capacitor assembly to the power module and mounted within the housing.

Scalable and modular approach for power electronic building block design in automotive applications

Methods of bonding components for fabricating electronic assemblies and electronic assemblies including bonded components are provided herein. In one example, a method of bonding components for fabricating an electronic assembly comprises the steps of disposing a first layer of a first high temperature metal-containing paste adjacent to a first component. A second layer of a second high temperature metal-containing paste is disposed adjacent to a second component. A nanostructured multilayer reactive foil is disposed between the first and second layers. The nanostructured multilayer reactive foil is activated to sinter the first and second layers and bond the first and second components.

Methods of bonding components for fabricating electronic assemblies and electronic assemblies including bonded components

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San Pedro, CA, United States of America

Vicentiu Grosu