Microsoft Technology Licensing, LLC

Nokia Technologies Oy

Comptek Solutions Oy

Nokia Corporation

Vicente Calvo Alonso

Esa Määttä

Antti Karilainen

Pasi Kemppinen

Jouko Lang

Ilpo Kalevi Kauhaniemi

Niko Eiden

Johnny Dahl

Otto Huittinen

Jussi Ropo

Mikael Kontkanen

Lassi Hyvönen

Catalin Gheorghiu

Oiva Sahlsten

Oiva Arvo Oskari Sahlsten

Mikko Juhola

Juha H-p Nurmi

Esa-Sakari Määttä

Pasi Tuomo Antero Kemppinen

Jaakko Mäkelä

Jouko Lång

Petri Merivirta

Kenneth Majander

Jouko Juho Kalevi Lång

An electronic device or electronic device assembly may comprise a first portion and a second portion, a first magnet disposed inside the first portion and rotatable about a pivot axis with respect to the first portion, and a second magnet disposed inside the second portion and rotatable about a pivot axis with respect to the second portion. The first and second magnet may be configured to rotate so that the first and second magnets magnetically engage each other when the distance between the first and second magnet is equal to or smaller than a first distance.

Magnetic block locking of an electronic device

The present disclosure is related to a semiconductor device and a method of manufacturing the said semiconductor device. The semiconductor device comprising a stacked configuration of a plurality of semiconductor layers. At least one of the semiconductor layers is a III-V compound semiconductor layer, and at least one of the III-V compound semiconductor layers has formed thereonto a corresponding crystalline terminating oxide layer, wherein the at least one of the plurality of semiconductor layers interfaces via its crystalline terminating oxide layer to a neighbouring epitaxial semiconductor layer thereto. The semiconductor device is a quantum well device.

Semiconductor device and manufacturing method

Disclosed is a semiconductor device and a method of fabricating the semiconductor device. The semiconductor device comprises a first III-V compound semiconductor layer having a first material structure, a second semiconductor layer having a second material structure and a third semiconductor layer having a third material structure. An interface between the first semiconductor layer and the second semiconductor layer consists of at least one corresponding crystalline terminating oxide layer of the first semiconductor layer, and an interface between the second semiconductor layer and the third semiconductor layer comprises at least one corresponding crystalline terminating oxide layer of a III-V compound semiconductor layer.

Heterostructure semiconductor device and manufacturing method

Disclosed is a semiconductor device and a method of manufacturing the said semiconductor device. The semiconductor device comprises a plurality of layers. The method of fabricating the semiconductor device comprises obtaining a substrate layer, arranging a first corresponding crystalline terminating oxide layer on the substrate layer, arranging at least one semiconductor layer on the first crystalline terminating oxide layer, arranging a second corresponding crystalline terminating oxide layer on the at least one semiconductor layer, and arranging an electrical insulating layer on the second crystalline terminating oxide layer.

Semiconductor device and method of manufacture

A modular hinge is described for a computing device where the computing device comprises two leaves detachably connected using the modular hinge. The hinge comprises a first hinge portion and a second hinge portion. Each hinge portion has a hinge portion body having a convex face configured to enable one of the leaves of the computing device to rotate against the convex face. Each hinge portion body has a mating face generally opposite the convex face, the mating face comprising at least one attachment element. Each hinge portion comprises a hinge pin configured to rotatably attach the hinge portion to one of the leaves of the computing device. The at least one attachment element of each hinge portion is configured to removably attach the hinge portions together.

Modular hinge for a computing device

A first device module comprises a first coupling arrangement; the first coupling arrangement comprising a first inductive coil, a first magnetic core positioned within the first inductive coil to form a first electromagnet, and a first control unit electrically connected to the first inductive coil. The first control unit is configured to supply first DC current to the first inductive coil to generate a first magnetic field to attract a second device module comprising a second magnetic element and a second inductive coil by magnetic force, and first AC current to the first inductive coil to inductively transmit a first data or power signal from the first inductive coil to the second inductive coil.

Coupling device modules for inductive data transmission

A bendable device is provided. The device comprises: a body comprising a bending region and a flexible display stack comprising at least one active layer and a supporting layer positioned on the bottom of the flexible display stack. The supporting layer of the flexible display stack comprises one or more fastening areas; the body comprises one or more fastening components; and one or more fastening components of the body are configured to be operable in a movable connection with one or more fastening areas of the flexible display stack.

Bendable device with display in movable connection with body

In an embodiment, a foldable device having a sensor is described. In an embodiment, the device comprises: A folding area, wherein the folding area is configured to rotate according to an axis of rotation caused by folding the device, causing deformation of the folding area. The folding area comprises: a layer of strain sensitive material having particles, wherein conductivity of the strain sensitive material is configured to change when the layer experiences the deformation. The folding area comprises a layer of conductor lines configured to detect the change of the conductivity of the strain sensitive material, wherein the layer of the conductor lines includes a plurality of contacting points with the strain sensitive material.

Foldable device having sensor

An electronic device having two or more opposing sides is disclosed. The electronic device comprises a display module, a window on the display module, and a frame at least partly surrounding the display module. The frame comprises, at two or more opposing sides of the electronic device, a side portion and an upper portion extending a determined distance from the side portion towards the opposing side of the electronic device and ending at an inner edge defining an opening having a width smaller than the width of the display module. The display module has an active area and an inactive area. The display module is disposed within the frame so that at least a part of the inactive area is disposed below and covered by the upper portion, at least a part of the active area being visible through the opening. The window is disposed in the opening.

Electronic device having a reduced dead border

A display integrated pressure sensor is described. In an example, a device comprises: a display including a plurality of layers; a layer of pressure sensitive material having particles; conductivity of the pressure sensitive material is configured to change when the layer experiences deformation; a layer of conductor lines configured to detect the change of the conductivity of the pressure sensitive material; the layer of conductor lines includes a plurality of contacting points with the pressure sensitive material; the layer of pressure sensitive material and the conductor lines are configured to be integrated within the display. In other examples, a manufacturing method and a display module are discussed along with the features of the device.

Display integrated pressure sensor

A deformation sensor comprises at least two electrodes on the surface of a substrate. The electrodes are separated by a gap, and the electrodes are arranged so that the gap comprises at least a part of a closed geometric shape. The gap contains a material loaded with conductive or semiconductive nanoparticles, whereby deformation of the substrate causes the resistance between the at least two electrodes to change.

Deformation sensor

A bendable device is provided. The device comprises: a display stack which comprises a window layer and at least one active layer, and a body which comprises an extendable bending region. The active layers are fixed to the window layer at the bottom side of the window layer. Edges of the window layer extend outwards in relation to the at least one active layer at two or more sides of the display stack, and the window layer is rigidly fixed to the body at the edges which extend outwards at the bottom side of the window layer. A method for assembling a bendable device comprising a display is disclosed.

Bendable device with a window top layer and a body having extendable bending region

In accordance with an example embodiment of the present invention, an apparatus is disclosed. The apparatus includes a display section and a touch panel section. The touch panel section is adjacent the display section. The touch panel section includes a first layer, a second layer and a third layer. The first layer includes a conductive material. The second layer includes a bottom guard layer. The third layer includes a top guard layer. The first layer is between the second and third layers. The conductive material includes a color filter and a black matrix.

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Piispanristi, Finland

Vicente Calvo Alonso