Hewlett-Packard Development Company, L.p.

Vic Hong Chia

Terrel L Morris

Eric C Peterson

Brandon Rubenstein

Martha G Peterson

Robert W Skoog

A cooling apparatus for a printed circuit board assembly is disclosed. The cooling apparatus comprises a main printed circuit (PC) board. The main PC boardhas a plurality of connectorsmounted, in a parallel row, onto the top side of the main PC board. A first liquid cooling manifoldis positioned along one end of the parallel row of connectorsand a second liquid cooling manifoldis positioned along the other end of the parallel row of connectors. A plurality of heat sink devices, each having an elongated shape, run parallel to, and on each side of, the plurality of connectors. The plurality of heat sink devicesare coupled to the first and second liquid cooling manifolds.

Printed circuit board cooling assembly

A cable assembly comprising a hollow sleeve, an electrical conductor within the hollow sleeve, and first and second connectors on opposing ends of the electrical conductor that are fastened to opposing ends of the sleeve. The first connector is adapted to blind-mate to a corresponding connector in a cabinet backplane and the second connector is adapted to couple to an electronic device to be installed in the cabinet. Power is provided from the backplane to the electronic device via the electrical conductor. The hollow sleeve is disposed within a tunnel supported by the cabinet. The hollow sleeve has a length greater than that of the tunnel such that the first connector protrudes from a first opening of the tunnel and the second connector protrudes from a second opening of the tunnel.

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Plano, TX, United States of America

Vic Hong Chia