Adeia Semiconductor Bonding Technologies Inc.

Vernon Solberg

Belgacem Haba

Thomas H DiStefano

Young Jae Kim

Philip Damberg

David A Gibson

Michael Warner

Young-Gon Kim

John B Riley, Iii

A stacked microelectronic assembly includes a plurality of microelectronic subassemblies. Each subassembly includes a substrate having at least one site, a plurality of first contacts and a plurality of second contacts. Each subassembly also has at least one microelectronic element assembled to the at least one attachment site and electrically connected to at least some of the first and second contacts. The substrate is folded so that the first contacts are accessible at a bottom of a subassembly and the second contacts are accessible at a top of a subassembly. The plurality of subassemblies are stacked one on top of another in a generally vertical configuration. The substrate of at least one of the subassemblies has a plurality of attachment sites and a plurality of microelectronic elements assembled to the attachment sites. The substrate is folded so that at least some of the plurality of microelectronic elements are disposed alongside one another.

Stacked microelectronic assemblies

A method of making a stacked microelectronic assembly includes providing a flexible substrate having a plurality of attachment sites, test contacts and conductive terminals, and including a wiring layer with leads extending to the attachment sites. The method includes assembling a plurality of microelectronic elements to the attachment sites and electrically interconnecting the microelectronic elements and the leads. The flexible substrate is then folded so as to stack at least some of the microelectronic elements in substantially vertical alignment with one another to provide a stacked assembly with the conductive terminals exposed at the bottom end of the stack and the test contacts exposed at the top end of the stack.

Stacked microelectronic assembly and method therefor

A multichip package includes a substrate including a plurality of conductive traces and flexible leads connected to outer ends of at least some of the conductive traces adjacent the periphery of said flexible substrate, the substrate including conductive terminals accessible at a surface thereof connected to at least some of the traces. The package includes a first microelectronic element having a front face including contacts and a back face, the front face of the first microelectronic element confronting the flexible substrate. The package also includes a second microelectronic element larger than the first microelectronic element, the second microelectronic element having a front face including contacts, the second microelectronic element overlying the first microelectronic element with the front face of the second microelectronic element facing toward the substrate. The flexible leads are connected to the second microelectronic element and at least some of the traces are connected to the first microelectronic element for electrically interconnecting the first and second microelectronic elements with one another and with the terminals.

Compliant multichip package

A stacked microelectronic assembly and its resulting structure includes a flexible substrate having a plurality of attachment sites, test contacts and conductive terminals, and including a wiring layer with leads extending to the attachment sites. The assembly includes a plurality of microelectronic elements assembled to the attachment sites and electrically interconnecting the microelectronic elements and the leads. The flexible substrate is folded so as to stack at least some of the microelectronic elements in substantially vertical alignment with one another to provide a stacked assembly with the conductive terminals exposed at the bottom end of the stack and the test contacts exposed at the top end of the stack. The assembly may be made using a dam and or a spacer to facilitate the folding process. Two stacked microelectronic assemblies may be stacked together by providing a first stacked assembly with a plurality of connection pads exposed at the top end and providing a second stacked assembly with a plurality of solder balls connected to the terminals at the bottom end. The first and second assemblies may be stacked by connecting the solder balls to the connection pads.

A multichip package includes a substrate including a plurality of conductive traces and flexible leads connected to outer ends of at least some of the conductive traces adjacent the periphery of said flexible substrate, the substrate including conductive terminals accessible at a surface thereof connected to at least some of the traces. The package includes a first microelectronic element having a front face including contacts and a back face, the front face of the first microelectronic element confronting the flexible substrate. The package also includes a second microelectronic element larger than the first microelectronic element, the second microelectronic element having a front face including contacts, the second microelectronic element overlying the first microelectronic element with the front face of the second microelectronic element facing toward the substrate. A compliant element is disposed alongside the first microelectronic element between the second microelectronic element and the substrate. The flexible leads are connected to the second microelectronic element and at least some of the traces are connected to the first microelectronic element for electrically interconnecting the first and second microelectronic elements with one another and with the terminals.

A method of making a stacked microelectronic assembly such as a semiconductor chip assembly and its resulting structure includes providing a flexible substrate having a plurality of attachment sites and conductive terminals and including a wiring layer with leads extending to the attachment sites. The method includes assembling a plurality of microelectronic elements to the attachment sites and electrically interconnecting the microelectronic elements and the leads so that the electrically connected microelectronic elements are movable relative to the flexible substrate. The flexible substrate is then folded so as to stack at least some of the microelectronic elements in substantially vertical alignment with one another to provide a stacked assembly with the conductive terminals exposed at the bottom end of the stack. The stacked assembly is held in place using a thermally conductive adhesive and/or a mechanical element. The stacking structure and methods of the present invention provide an economical and space-saving assembly for use in electronic components. The flexibility of the electrical connection between each microelectronic element and the substrate provides for reliable electrical interconnections between the substrate and the microelectronic elements during thermal cycling.

A method of making a multichip package includes providing a flexible substrate having a plurality of conductive traces and flexible leads connected to outer ends of the conductive traces adjacent the periphery of said flexible substrate. The flexible substrate includes conductive terminals accessible at a surface thereof connected to at least some of the conductive traces. The method includes providing a first microelectronic element having a front face including contacts and a back surface and assembling the front face thereof with the flexible substrate; depositing a compliant element over the back surface of the first microelectronic element; providing a second microelectronic element having a front face including contacts and assembling the front face thereof with the compliant element so that the second microelectronic element overlies the first microelectronic element; and electrically interconnecting the first and second microelectronic elements with one another and with the conductive terminals by connecting the flexible leads to the second microelectronic element and connecting at least some of the traces to the first microelectronic element.

Method of making a compliant multichip package

A method of making a microelectronic assembly includes providing a starting subassembly having a microelectronic component with a top surface and having electrical contacts, the subassembly further including a plurality of terminals over the top surface of the component, each terminal being connected to at least one contact of the component but moveable with respect to the component; positioning a plurality of joining units each having a solid core on the terminal; providing a unit bonding material at interfaces between each core terminal; and bonding the joining units to the terminals by heating the joining units and terminals so as to convert the unit bonding material to a liquid phase without melting the cores and solidifying the unit bonding material.

Methods of making microelectronic assemblies

A microelectronic component such as a semiconductor chip having electrical contacts is provided with terminals, the terminals being movable relative to the component. A joining unit having a solid core is disposed on each terminal and extends upwardly, away from the component. Each unit includes a bonding material such as a solder bonding the terminal and the solid core, the bonding material desirably defining a waist or narrow section spaced above the terminal, the waist having a curved surface forming a stress-relieving fillet. The joining units are bonded to contact pads of a substrate such as a circuit panel as by bonding the solder of the joining units to the terminals, or by means of a further solder on the contact pads having a lower melting point. The assembly provides substantial resistance to mechanical stress caused by thermal expansion. Preferably, the terminals are movable in vertical directions towards the component to compensate for nonplanarity during assembly.

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Saratoga, CA, United States of America

Vernon Solberg