Cooper Industries, Inc.

Cooper Technologies Company

Mcgraw-edison Company

Cooper Technologies, Inc.

Vernon Raymond Spaunhorst

Stephen J Whitney

Joan L Winnett

Leon Gurevich

Varinder Kumar Kalra

Farid Ghaderi

Edward G Glass

Angelo Urani

Keith Allen Spalding

Frank Suher

Glen A Dunn

Terry E Rupp

Curtis R Green

Varinda Kalra

John E Hunkins

A chip fuse includes a substrate, a fuse element extending on the substrate, and first and second wire leads coupled to the fuse element. Contact pads may extend over portions of the fuse element and establish electrical connection to the first and second leads. A conductive medium such as solder encircles the substrate to securely form a mechanical and electrical connection to the leads.

Hybrid chip fuse assembly having wire leads and fabrication method therefor

A fuse includes a housing and terminal blades extending therefrom. Each terminal blade includes a stop face, a stop brace, a hold face, and a hold brace. The stop face and stop brace prevent over insertion of the terminal blade through a circuit board and separate the fuse housing from the circuit board. The stop brace and hold brace position the housing relative to the board and prevent dislodging of the blades from the board during soldering operations.

Circuit board blade fuse

A method for fabricating transient voltage protection devices is described wherein a gap between a ground conductor and another conductor is formed using a diamond dicing saw. Substrate material selection and includes specific ceramic materials designed to optimize performance and manufacturability. An overlay layer can be provided to minimize burring of the conductors during formation of the gap.

Transient voltage protection device with ceramic substrate

A transient voltage protection device is described wherein a gap between a ground conductor and another conductor is formed using a diamond dicing saw. Substrate material selection includes specific ceramic materials having a density of less than 3.8 gm/cm.sup.3 designed to optimize performance and manufacturability. An overlay layer can be provided to minimize burring of the conductors during formation of the gap.

A method of manufacturing a chip fuse includes the steps of depositing a plurality of columns of electrically conductive metal film on a green, unfired ceramic substrate, and disposing a plurality of wire elements on the substrate over the film columns and perpendicular to the film columns. A cover of green, unfired ceramic is bonded to the substrate over the wire elements and film columns to form a laminate. The laminate is then die cut into individual fuses, which are then fired to cure the ceramic and form an intermetallic bond between the wire elements and the metal film. End termination coatings are then applied to the fuses to facilitate connecting the fuses in an electrical circuit. The invention relates to a chip fuse manufactured according to the method.

Method of making wire element ceramic chip fuses

A subminiature circuit protector includes an electrically insulating substrate, a fuse element connecting end termination pads, the termination pads extending to end and lateral edges of the substrate, an electrically insulation cover over the fuse element and termination pads, and end terminations formed over the end and a portion of the lateral surfaces of the substrate electrically connecting with the termination pads.

Subminiature surface mounted circuit protector

The improved fuse assembly includes a trigger assembly having an electrically nonconductive barrel for receiving a spring loaded trigger therein and a heater strip disposed along the outer circumferential surface of the barrel with a pair of end flaps. One end flap has a hole therethrough which fits over the end of the trigger adjacent the short circuit element. A second flap fits over the end of the barrel adjacent the end ferrule. The short circuit element, which is electrically and mechanically linked to a ferrule on the opposite end of the tube from the trigger assembly, engages the trigger and heater element in a solder fusing alloy.

Fuse assembly

A subminiature fuse comprising two terminals, a substrate, a fusible conductor, ceramic coating, a second coating and a unitary housing. A ceramic substrate 80 plated at both ends is inserted into fingers (70) in terminal, a fusible wire element 10 is strung between the fingers (70) and (20, 30) and electrically connects the terminal (20, 30). The assembly 160 is encased in a ceramic adhesive 180 which is encased in a second material (200) with superior dielectric properties. The ceramic encased assembly is enclosed in a unitary housing by injection molding.

Subminiature fuses

A terminal adapter for a cartridge fuse accommodating the installation of the fuse in fuse holders of a different size and type while at time insuring the installation of the proper class of fuse in a particular application.

Cartridge fuse terminal adapter

A subminiature fuse is disclosed comprising two terminals, a substrate, a fusible conductor, and a unitary housing. The unitary housing is sealed and provides increased mechanical strength, thus reducing the risk of a catastrophic failure of the fuse. The upper portion of the fuse terminals are shaped into finger like projections adaptable to mechanically fastening the fusible conductor and the substrate thereto thus facilitating the manufacturing process. In one embodiment the fusible conductor and adjacent portions of the terminals and substrate are coated with a ceramic coating or adhesive. The housing is sealed by ultrasonic welding or preferably in an insert molded plastic enclosure which is substantially devoid of air.

Subminiature fuse

A time delay fuse includes a tubular housing of insulative material with first and second open ends. First and second metallic or electrically conductive ferrules are mounted on the first and second ends, respectively, of the tubular housing. A core is positioned within the tubular housing and affixed to the ferrules by electrically conductive material such as solder. At least one short inner wire extends along the core and is electrically and mechanically connected to the solder. A second wire, longer than the first wire, is spirally wound around the core and the first inner wire. The second wire includes first and second ends mechanically and electrically connected to the conductive material such that the first and second wires are electrically parallel.

Growing community of inventors

Washington, MO, United States of America

Vernon Raymond Spaunhorst