Motorola Corporation

Vernon R Scott

James E Mitzlaff

Hugh Robert Malone

Douglas J Mathews

James M Henderson

John L Leicht

Scott D Munier

Kenneth C Cote

Michele G Oehlerking

Printed circuits which reside on three dimensional surfaces are disclosed. Using a first technique, a three dimensional surface is formed on a substrate having a high melting point or permitting a high degree of infrared energy transmittance. The surface contains a layer of metalization maintained at a depth of less than two microns. An infrared laser then moves around the surface and selectively vaporizes metalization leaving a desired printed circuit pattern. The remaining metalization is plated to a useable depth. Using a second technique, a fiber optic bundle is machined on one end to mate with the three dimensional surface. The three dimensional surface, metalized and coated with photo resist, resides in intimate contact with this first end. A second end of the cable is flat and resides in intimate contact with two dimensional master photo artwork. A pattern is exposed on the photoresist through the fiber optic bundle, and the metalization is etched using conventional techniques.

Three dimensional printed circuits

A non-hermetic, three-dimensional, microwave semiconductor device carrier with integral waveguide couplers is disclosed. A molded plastic substrate having a suitable dielectric constant and varying thicknesses comprises plated conductors and locations for receiving GaAs MMIC's. MMIC's are mounted to a metal backplate and die bonded to the plated conductors. The waveguide couplers are integrally molded as part of the carrier substrate, and comprise plated through cylindrical members. Signals from a waveguide cavity are coupled to the MMIC's by inserting the waveguide couplers into a waveguide port. The carrier and integral waveguide coupler together with a plated molded cover forms a non-hermetic package providing pseudo-shielding cavities about the resident multiple semiconductor GaAs die. Transmission line impedance control is enhanced varying the substrate thickness on a per conductor basis. Frequency of operation exceeds 12 gigahertz.

Three-dimensional microwave circuit carrier and integral waveguide

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Scottsdale, AZ, United States of America

Vernon R Scott