Broadcom Corporation

Broad Corporation

Vernon M Wnek

Kevin L Seaman

A method, system, for optimizing routing layers and board space requirements for a ball grid land pattern is described. A number of required pads is determined. A land pattern to yield the required pads is selected. A number of required perimeter routing channels is determined. A size of the land pattern to yield the required perimeter routing channels is optimized. At least one perimeter edge of the land pattern is under populated. In a further aspect, a number of layers is determined when a substrate has multiple layers.

Method for optimizing routing layers and board space requirements for a ball grid array land pattern

A method and apparatus for improved contact pad arrays and land patterns for integrated circuit packages are presented. A plurality of conductive pads are arranged in an array of rows and columns. At least one edge of a perimeter of the array is not fully populated with conductive pads. Spaces created in the edge by missing conductive pads create additional routing channels for signals from conductive pads within the array to be routed external to the array through the edge. A land pattern may have routing channels on one or more layers of a printed circuit board. In such a multi-layer land pattern, spaces can be created in edges on any number of the layers. Furthermore, corner pad arrangements having known routing channel characteristics can be used in any number of corners of a land pattern that incorporates spaces in an edge.

Optimization of routing layers and board space requirements for ball grid array package implementations including array corner considerations

A method, system, and apparatus for optimizing routing layers and board space requirements for a ball grid array package is described. The ball grid array package includes a substrate material having a first side configured to receive a semiconductor chip and a second side having a plurality of conductive pads arranged in an array of rows and columns. The array of pads has at least one edge not fully populated with pads.

Optimization of routing layers and board space requirements for a ball grid array package

A method, system, and apparatus for optimizing routing layers and board space requirements for a ball grid array land pattern is described. The land pattern includes a plurality of conductive pads arranged in an array of rows and columns. The array of pads has at least one edge of a perimeter of the array not fully populated with conductive pads, whereby spaces are created in the at least one edge by the missing conductive pads. The spaces create additional routing channels for signals from conductive pads within the array to be routed externally to the array through the at least one edge.

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Yorba Linda, CA, United States of America

Vernon M Wnek