Ferro Corporation

Vernon E Stygar

Jesus E Osuna

Keith M Mason

Ronald M Harris

Brian T Pointer

Dennis C Skovran

John J Ekis

Leo F Lightner

Qizhuo Zhuo

Michael S Randall

The present invention provides a novel screen printable thermosetting composition for forming thermally conductive interface and a method of using the same. The composition is used to promote the transfer of heat from a source of heat such as an electronic device to a heat dissipation device such as a heat sink. The composition comprises by weight from about 35% to about 75% of a thermal curing vinyl terminated siloxane material, from about 0.005% to about 5% catalyst, from about 10% to about 30% hydrocarbon solvent and from about 20% to about 70% conductive filler.

Screen printable thermally curing conductive gel

The present invention provides a novel UV curable composition for forming thermally conductive interface and a method of using the same. The composition is used to promote the transfer of heat from a source of heat such as an electronic device to a heat dissipation device such as a heat sink. The composition comprises by weight from about 35% to about 75% of a UV curable acrylate material, from about 0.5% to about 15% catalyst, from about 10% to about 30% hydrocarbon solvent and from about 20% to about 70% conductive filler.

Screen printable curable conductive material composition

This invention relates to a thermally conductive moldable polymer blend comprising a thermoplastic polymer having a tensile at yield of at least 10,000 psi; at least 60% by weight of a mixture of boron nitride powders having an average particle size of at least 50 microns; and a coupling agent. The composition displays a thermal conductivity of at least about 15 W/m.degree. K and it is capable of being molded using high speed molding techniques such as injection molding.

Thermally conductive thermoplastic

The present invention provides a screen printable thermosetting composition for forming thermally conductive interface and a method of using the same. The composition is used to promote the transfer of heat from a source of heat such as an electronic device to a heat dissipation device such as a heat sink. The composition comprises by weight from about 35% to about 75% of a thermal curing vinyl terminated siloxane material, from about 0.005% to about 5% catalyst, from about 10% to about 30% hydrocarbon solvent and from about 20% to about 70% conductive filler.

Screen printable UV curable conductive material composition

The present invention relates to compositions for use in forming resettable electronic circuit protection devices or fuses, methods of forming resettable fuses using the compositions, and resettable fuses formed from the compositions. Resettable fuse compositions according to the present invention include a mixture of the reaction product of polyethylene glycol and a diepoxide having a molecular weight of at least 18,000, solvent, conductive particles, and optional solvent volatility adjusters. In a preferred embodiment, resettable fuses according to the present invention are formed by screen printing the compositions directly onto printed electric circuits to form fuses. During current overload conditions, the temperature of the resettable fuse material rapidly increases due to resistive heating generated by excessive current flow through the conductive particle chains or pathways. In such current overload conditions, resettable fuses according to the present invention rapidly convert from a low resistance solid state to a high resistance liquidus state wherein the chains of conductive particles become highly separated thus causing the flow of electric current through the fuse to become completely cut off. After the overload condition has been cleared, resettable fuses according to the present invention self cool, re-solidify, and return to their prior low resistance solid state without exhibiting any change in resistance or switching temperature due to changes in the degree of crystallinity of the heat cured reaction product.

Growing community of inventors

San Diego, CA, United States of America

Vernon E Stygar