Texas Instruments Corporation

Broadcom Corporation

Angiometrix Corporation

Venugopal Gopinathan

Udayan Dasgupta

Abhijit Anant Patki

Ganesan Thiagarajan

Oscar Ernesto Agazzi

Subhashish Mukherjee

Goutam Dutta

Nitin Patil

Raghavan Subramaniyan

Sandeep Kumar Gupta

Sherif Galal

Madhulatha Bonu

Raja Selvaraj

Janakiraman S

Srinath Hosur

Jaiganesh Balakrishnan

Nirmal Chindhu Warke

Sthanunathan Ramakrishnan

Derek Hing Sang Tam

An example integrated circuit die includes: lower level conductor layers, lower level insulator layers between the lower level conductor layers, lower level vias extending vertically through the lower level insulator layers, upper level conductor layers overlying the lower level conductor layers, upper level insulator layers between and surrounding the upper level conductor layers, upper level vias; at least two scribe seals arranged to form a vertical barrier extending vertically from the semiconductor substrate to a passivation layer at an upper surface of the integrated circuit die; and at least one opening extending vertically through one of the at least two scribe seals and extending through: the upper level conductor layers, the upper level via layers, the lower level conductor layers, and the lower level via layers.

Methods and apparatus for scribe seal structures

In described examples, a first die includes a primary LC tank oscillator having a natural frequency of oscillation to induce a forced oscillation in a secondary LC tank oscillator of a separate second die via a magnetic coupling between the primary LC tank oscillator and the secondary LC tank oscillator.

Apparatus for die-to-die communication

An example integrated circuit die includes: a plurality of lower level conductor layers, a plurality of lower level insulator layers between the plurality of lower level conductor layers, a plurality of lower level vias extending vertically through the lower level insulator layers, a plurality of upper level conductor layers overlying the lower level conductor layers, a plurality of upper level insulator layers between and surrounding the upper level conductor layers, a plurality of upper level vias; at least two scribe seals arranged to form a vertical barrier extending vertically from the semiconductor substrate to a passivation layer at an upper surface of the integrated circuit die; and at least one opening extending vertically through one of the at least two scribe seals and extending through: the upper level conductor layers, the upper level via layers, the lower level conductor layers, and the lower level via layers.

Methods and systems for determining information about a vascular bodily lumen are described. An exemplary method includes generating an electrical signal, delivering the electrical signal to a plurality of excitation elements in the vicinity of the vascular bodily lumen, measuring a responsive electrical signal from a plurality of sensing elements in response to the delivered electrical signal, and determining a lumen dimension. Specific embodiments include generating a multiple frequency electrical signal. Another embodiment includes measuring a plurality of responsive signals at a plurality of frequencies. Still other embodiments include using spatial diversity of the excitation elements. Yet other embodiments use method for calibration and de-embedding of such measurements to determine the lumen dimensions. Diagnostic devices incorporating the method are also disclosed, including guide wires, catheters and implants. The methods and systems described herein are advantageous as they do not include injecting a second fluid for the measurements.

Methods and systems for determining vascular bodily lumen information and guiding medical devices

In apparatus for die-to-die communication, a first die includes at least a first circuit, and a second die includes at least a second circuit. The first die is separated by a fixed distance from the second die. In response to a signal, the first circuit is configured to induce a current in the second circuit via a magnetic coupling between the first circuit and the second circuit.

Method and apparatus for die-to-die communication

A snapout calculator, and wherein the snapout calculator determines where the reference levels for the various comparators shall be placed after each asynchronous sample is generated.

Asynchronous sampling using a dynamically adustable snapback range

An apparatus, comprising: an analog to digital converter including: a clipping detector; and a post-processor, wherein the post processor generates synchronous values of clipped data based on non-clipped values of non-clipped data.

Extension of ADC dynamic range using post-processing logic

A method, comprising: receiving an analog input; determining an upper outer rail and a lower outer rail as polling values to be used by voltage comparators; blanking at least three comparators; determining which two of the at least three comparators are closest to the input analog voltage levels; defining the two comparators which are closest to the analog input signal to be the next comparators of the next sampling process; assigning a remaining comparator at a voltage level in between the new top and bottom voltage levels; enabling the outer rails, but blanking the inner rail; progressively narrowing down the voltage range spanned by the two outer comparators; and generating a 2-tuple value of an asynchronous voltage comparator crossing.

Asynchronous sampling using dynamically configurable voltage polling levels

A method is provided. An analog signal is received. The analog input signal is compared to first and second reference signals to generate a first comparison result, and the first comparison result and a first time stamp corresponding to the first comparison result are registered. A first portion of a digital signal is generated from the first comparison result. At least one of the first and second reference signals is adjusted. A second comparison result is generated if the analog signal reaches an adjusted one of the first and second reference signals within a predetermined interval, and a second portion of the digital signal is generated from the second comparison result.

Asynchronous analog-to-digital converter having adapative reference control

A method is provided. An analog signal is received. The analog input signal is compared to first and second reference signals to generate a first comparison result, and the first comparison result and a first time stamp corresponding to the first comparison result are registered. A first portion of a digital signal is generated from the first comparison result. If the comparison result remains substantially the same for a predetermined interval, an ADC is enabled to generate a second comparison result at a sampling instant. A second time stamp that corresponds to the sampling instant is generated. The second comparison result and a second time stamp corresponding to the first comparison result are registered, and a second portion of the digital signal is generated from the second comparison result.

Asynchronous analog-to-digital converter

An apparatus is provided. A comparison circuit is configured to receive an analog signal. A reference circuit is coupled to the comparison circuit and is configured to provide a plurality of reference signals to the comparison circuit. A conversion circuit is coupled to the comparison circuit and is configured to detect a change in the output of the comparison circuit. A time-to-digital converter (TDC) is coupled to the comparison circuit. A timer is coupled to the comparison circuit. A rate control circuit is coupled to the conversion circuit. An output circuit is coupled to the rate control circuit and the TDC, where the output circuit is configured to output at least one of a synchronous digital representation of the analog signal and an asynchronous digital representation of the analog signal.

Asynchronous analog-to-digital converter having rate control

A method for communicating signals in an ultra high bandwidth system that compensates for carrier frequency offset is provided. A baseband transmit signal having a plurality of data bits is generated. The baseband transmit signal is upconverted to a radio frequency (RF) transmit signal using a first local oscillator signal having a first carrier frequency. An offset cancellation for the offset between the first carrier frequency and a second carrier frequency for a second local oscillator signal that is used to downconvert an RF receive signal is calculated. The offset cancellation is applied to a plurality of phase rotators, and the RF transmit signal is transmitted over a phased array.

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Bengaluru, India

Venugopal Gopinathan