Avago Technologies General IP (singapore) Pte. Ltd.

Avago Technologies International Sales Pte. Limited

Venkatesh Seetharam

Laurence Ray McColloch

Michael Allen Robinson

Georgios Asmanis

David W Dolfi

Frank David Yashar

Robert G Ritter

Sunil Priyadarshi

Alexander Robertson

An optical communication system, device, and method are disclosed. An illustrative optical communication system is disclosed to include a carrier Integrated Circuit (IC) chip having an amplifier circuit, a bias plane, and a ground plane. The amplifier circuit, bias plane, and the ground plane may each operate at or above a nominal voltage of zero volts. A laser diode may be integrated with an electro-absorption modulator into a single IC chip, where the laser diode is mounted on the carrier IC chip and is electrically connected with the amplifier circuit of the carrier IC chip through a bond wire.

Optical communication device and system

A ferrule of an optical communications module is allowed to float to a limited degree within the module housing. Consequently, if a force is exerted on the connector that mates with the optical communications module, the mated ferrules of the module and of the connector moves, or floats, within defined limits so that the ferrules move together rather than relative to one another. In this way, the end faces of the ferrules remain in precise alignment to prevent wiggle losses from occurring due to movement of the connector relative to the module housing.

Optical communications module having a floating ferrule that reduces wiggle loss

A lead frame assembly for an integrated circuit package includes a lead frame, a die, first and second information signal-carrying bond wires, first and second ground bond wires, and first and second ground down bond wires. Each ground bond wire shares a die pad with one of the ground down bond wires.

Bond wire arrangement for minimizing crosstalk

Growing community of inventors

Fremont, CA, United States of America

Venkatesh Seetharam