Intel Corporation

Venkatesh Prasanna

Kedar Mangrulkar

Inder M Sodhi

Varghese George

Sanjeev S Jahagirdar

George L Geannopoulos

David E Duarte

Usman Mughal

Mathew B Nazareth

Vijay K Vuppaladadium

Tanveer R Khondker

Miguel Corvacho

Nakul Arora

An embodiment of the present invention is a technique for thermal sensing. A sensing structure generates a response according to a local temperature at a first location on a die. A sensor core coupled to the sensing structure via routing lines to provide a measurement of the local temperature from the response. The sensor core is located at a second location remote to the first location and is powered by an analog supply voltage source located in a vicinity of the second location.

Accurate on-die temperature measurement using remote sensing

A device and method for continually monitoring multiple thermal sensors located at hotspots across a processor. The sensors are connected to a sensor cycling and selection block located at a periphery of the die. The output from the sensor selection block is converted into a digital temperature code. Based on the digital temperature code, thermal events trigger various thermal controls. The thermal event triggers may be software-programmable, providing flexible temperature management.

Method and apparatus for accurate on-die temperature measurement

Circuits and methods align an internal signal with an external signal. A phase lock loop network receives the external signal to generate phase lock loop signals. A programmable ratio decoder provides a code. An alignment unit generates the internal signal based on at least one of the phase lock loop signals. The alignment unit aligns internal signal with the external signal based on the code.

Circuits and methods for alignment of signals in integrated circuits

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Folsom, CA, United States of America

Venkatesh Prasanna