Intel Corporation

Gtat Corporation

Merlin Solar Technologies, Inc.

Xilinx, Inc.

Twin Creeks Technologies, Inc.

Jds Uniphase Corporation

Venkatesan Murali

Gopal Prabhu

Arvind Chari

Venkateswaran Subbaraman

David Tanner

Robert Brainard

Christopher John Petti

Suresh Ramalingam

Steve E Babayan

Mohamed M Hilali

Zhiyong Li

Alejandro De La Fuente Vornbrock

Arthur Rudin

Dong Xu

Theodore H Smick

Gopalakrishna B Prabhu

Kathy Jackson

Rama Shukla

Jesse Dam

Arifur Rahman

Douglas E Crafts

David B Fraser

Nagesh K Vodrahalli

Thomas Edward Dinan, Jr

Ameet S Bhansali

Duane Cook

Brian A Kaiser

Kevin Jeng

Gay M Samuelson

Michael J Gasparek

Shou H Chen

Nicholas P Mencinger

Ching C Lee

Michael J Hart

Jyoti Kiron Bhardwaj

Kenzo Ishida

David J Dougherty

Siegfried B Fleischer

Hiroaki Yamada

Kent Riley Child

Adam Brailove

Brett Matthew Zaborsky

Mukul Joshi

Steve Bababyan

Orion Leland

Steve Babayan

Anant Vaidyanathan

Niphon Lapanaphan

Chagkapong Chitsamart

Sarinee Prompanut

Edward Dechaumphai

Chih-Shih Wei

Chin-Shih Wei

Caroline S Lee

A method includes providing an electrically conductive mandrel having an outer surface layer comprising a preformed pattern. The metallic article is electroformed. The metallic article includes a plurality of electroformed elements formed in the preformed pattern on the outer surface layer of the mandrel. The plurality of electroformed elements have a first side adjacent to the outer surface layer of the mandrel and a second side. The metallic article is separated from the mandrel. The plurality of electroformed elements are interconnected such that the metallic article forms a unitary, free-standing piece. A solution is applied to create a blackening of the first side of the plurality of electroformed elements.

Method for blackening a metallic article

A method includes providing a mandrel having an electrical conduit electroformed in the mandrel. The second side of the electrical conduit is blackened while in the mandrel to create a black layer on the electrical conduit. The mandrel is aligned in a flatness fixture such that the mandrel is substantially flat. The mandrel remains flat and in a fixed relationship to the flatness fixture throughout the method. A beam of a laser is controlled toward the black layer. The beam has laser parameters including a power output, a frequency and a mark speed, and selected by setting the power output and the mark speed then determining the frequency. The beam removes a plurality of the portions of the black layer. Each removed portion of the plurality of the portions has a thickness equal to the black layer thickness, and a portion area of 9 mmto 18 mm.

Method for blackening an electrical conduit

In embodiments, a photovoltaic cell has an expanded metal article configured as a mesh, a semiconductor material, and a front metallic article. The expanded metal article has a plurality of first segments intersecting a plurality of second segments thereby forming a plurality of openings, and has a plurality of cuts in the mesh. The expanded metal article is electrically coupled to a back surface of the semiconductor material. The front metallic article has a plurality of electroformed elements interconnected to form a unitary, free-standing piece comprising a continuous grid. The continuous grid of the front metallic article is electrically coupled to a front surface of the semiconductor material. The plurality of cuts of the expanded metal article is arranged on the photovoltaic cell to relieve stresses induced by the front metallic article on the front surface of the semiconductor material.

Photovoltaic cell having a coupled expanded metal article

A method includes providing an electrically conductive mandrel having an outer surface layer comprising a preformed pattern. The metallic article is electroformed. The metallic article includes a plurality of electroformed elements formed in the preformed pattern on the outer surface layer of the mandrel. The plurality of electroformed elements have a first side adjacent to the outer surface layer of the mandrel and a second side. A solder is plated on the second side of the plurality of electroformed elements while on the mandrel. The metallic article is separated from the mandrel. The plurality of electroformed elements are interconnected such that the metallic article forms a unitary, free-standing piece. A solution is applied to create a blackening of the first side of the plurality of electroformed elements. The solder on the second side of the plurality of electroformed elements is not blackened.

Methods include providing an expanded metal article configured as a mesh. The expanded metal article has a plurality of cuts in the mesh and has a surface comprising a plurality of solder pads. A semiconductor material is provided, having a back surface comprising a plurality of silver pads. A front surface of the semiconductor material serves as a light-incident surface of the photovoltaic cell. A front metallic article is provided, the front metallic article comprising a plurality of electroformed elements interconnected to form a unitary, free-standing piece comprising a continuous grid. The continuous grid of the front metallic article is electrically coupled with the front surface of the semiconductor material. The plurality of cuts of the expanded metal article is arranged to relieve stresses induced by the front metallic article on the front surface of the semiconductor material.

A bonding apparatus includes a heat source, a first plate, a second plate, and an actuation mechanism. The first plate is coupled to the heat source. The first and second plates are thermally conductive and configured to cover an entire solar cell. The actuation mechanism moves the bonding apparatus between an open position and a closed position. In the closed position, the first plate and the second plate contact opposite surfaces of the solar cell. The second plate is configured to dissipate heat such that the second plate has a lower temperature than the first plate when in the closed position. The first plate and the second plate apply a force to the solar cell, the force at a first end of the solar cell being different than at a second end of the solar cell when the bonding apparatus is in or moving to the closed position.

Solar cell bonding

A method comprises providing an expanded metal article having a plurality of first segments intersecting a plurality of second segments thereby forming a plurality of openings. The expanded metal article has a surface comprising a plurality of solder pads. A semiconductor material with a top surface and a bottom surface is provided, the bottom surface having a plurality of silver pads and the top surface serving as a light-incident surface of the photovoltaic cell. At a plurality of soldering locations, a majority of the plurality of solder pads on the surface of the expanded metal article is electrically coupled with the plurality of silver pads on the bottom surface of the semiconductor material. Also disclosed is a photovoltaic cell resulting from this method.

An integrated circuit (IC) combines a first IC chip (die) having a first on-chip interconnect structure and a second IC chip having a second on-chip interconnect structure on a reconstructed wafer base. The second IC chip is edge-bonded to the first IC chip with oxide-to-oxide edge bonding. A chip-to-chip interconnect structure electrically couples the first IC chip and the second IC chip.

Multi-chip integrated circuit

A free-standing metallic article, and method of making, is disclosed in which the metallic article is electroformed on an electrically conductive mandrel. The mandrel has an outer surface with a preformed pattern, wherein at least a portion of the metallic article is formed in the preformed pattern. The metallic article is separated from the electrically conductive mandrel, which forms a free-standing metallic article that may be coupled with the surface of a semiconductor material for a photovoltaic cell.

Free-standing metallic article for semiconductors

A free-standing metallic article, and method of making, is disclosed in which the metallic article is electroformed on an electrically conductive mandrel. The metallic article has a plurality of electroformed elements that are configured to serve as an electrical conduit for a photovoltaic cell. A first electroformed element has at least one of: a) a non-uniform width along a first length of the first element, b) a change in conduit direction along the first length of the first element, c) an expansion segment along the first length of the first element, d) a first width that is different from a second width of a second element in the plurality of electroformed elements, e) a first height that is different from a second height of the second element in the plurality of electroformed elements, and f) a top surface that is textured.

Adaptable free-standing metallic article for semiconductors

The invention provides a method of forming an electronic device from a lamina that has a coefficient of thermal expansion that is matched or nearly matched to a constructed metal support. In some embodiments the method comprises implanting the top surface of a donor body with an ion dosage to form a cleave plane followed by exfoliating a lamina from the donor body. After exfoliating the lamina, a flexible metal support that has a coefficient of thermal expansion with a value that is within 10% of the value of the coefficient of thermal expansion of the lamina is constructed on the lamina. In some embodiments the coefficients of thermal expansion of the metal support and the lamina are within 10% or within 5% of each other between the temperatures of 100 and 600&#xb0; C.

Multi-layer metal support

A method of reducing variation in multi-die integrated circuits can include, for each of a plurality of dies, determining at least one performance metric and selecting at least two dies for inclusion within a multi-die integrated circuit according to the at least one performance metric. Systems and devices for executing the steps of the method are also described.

Reducing variation in multi-die integrated circuits

A method for fabricating a backside-illuminated sensor includes providing a thin film semiconductor lamina having a first conductivity, and forming a doped region having a second conductivity within the lamina and at a front surface of the lamina. The lamina may be provided as a free-standing lamina, or may be provided as a semiconductor donor body from which the lamina is cleaved. An electrical connection is formed to the doped region. A temporary carrier is contacted to the back surface of the semiconductor and later removed. A backside-illuminated sensor is fabricated from the semiconductor lamina, in which the thickness of the semiconductor lamina remains substantially unchanged during the fabrication process.

Method for fabricating backside-illuminated sensors

The invention provides for a semiconductor wafer with a metal support element suitable for the formation of a flexible or sag tolerant photovoltaic cell. A method for forming a photovoltaic cell may comprise providing a semiconductor wafer have a thickness greater than 150 &#x3bc;m, the wafer having a first surface and a second surface opposite the first and etching the semiconductor wafer a first time so that the first etching reduces the thickness of the semiconductor wafer to less than 150 &#x3bc;m. After the wafer has been etched a first time, a metal support element may be constructed on or over the first surface; and a photovoltaic cell may be fabricated, wherein the semiconductor wafer comprises the base of the photovoltaic cell.

Method for forming flexible solar cells

Growing community of inventors

San Jose, CA, United States of America

Venkatesan Murali