Texas Instruments Corporation

Western Electric Company, Inc.

Venkataraman Srinivasan

Stephen Cassidy

Richard Haynes

John Louis Bestel

Charles Grassie

A plurality of articles are advanced in continuous sequence in spaced relation to each other through an electroplating bath to pass in sliding engagement with a pair of lands, thereby to move selected, laterally-extending strips of the articles along an anode surface located between the lands in selected, closely spaced, facing relation to the anode surface. Jets of the electroplating solution are directed through a plurality of openings in the anode surface to provide a continuous positive flow of electroplating solution in a direction from the anode surface against the selected strips of the articles moving past the anode surface and to permit the flow of electroplating solution to pass between the articles while the lands substantially restrict the flow of the electroplating solution in other directions. Electrical current is directed through the flowing electroplating solution between the anode surface and the article strips for plating the selected article strips to a desired thickness.

Method for selectively electroplating portions of articles

A method of selectively plating an area of a substrate surface is disclosed. The method comprises contact masking at least one charged anode, spaced from the surface, with a dielectric member which is maintained between the anode and the surface, along their corresponding opposed surface areas, out of contact with the surface. The surface is cathodically charged. The masked anode is contacted with a stream of an electroplating electrolyte. The stream of electrolyte then contacts at least a portion of the charged surface, including the area to be plated, to fully flow electrolyte thereover to selectively electroplate the area.

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Attleboro, MA, United States of America

Venkataraman Srinivasan