Lear Corporation

Venkat Rao Yalamanchili

Rutunj Rai

Richard Joseph Hampo

Parminder Brar

Michael Scott Duco

Nadir Sharaf

Dilip Daftuar

George Kaminski

The present disclosure includes an electrical power transformer that may include a core and a conductor pack. A conductor pack may include a conducting layer disposed around a portion of the core, a first planar insulating layer disposed on a first side of the conducting layer, and a second planar insulating layer disposed on a second side of the conducting layer. A cooling member may be disposed adjacent to the conductor pack. A method of manufacturing an electrical power transformer may include providing a core and providing a plurality of planar conductor packs. The planar conductor packs including a plurality of planar conducting layers and a plurality of planar insulating layers. The method may include inserting a cooling member between insulating layers of adjacent ones of the plurality of planar conductor packs.

Cooling method for planar electrical power transformer

A planar transformer includes conductor plates each having a channel separating a region of the conductor plate into first and second portions. Each conductor plate corresponds to one wire turn of a winding coil with one of the first and second portions being a start point of the wire turn and the other one of the first and second portions being an end point of the wire turn.

Planar transformer

A coldplate for use in cooling electrical components may include first and second coldplate members, each having a pocket and a secondary portion. The pocket of each member is configured to receive an electrical component and sized to substantially surround the component when received in the pocket to provide physical integration of the component in the coldplate member. The first and second coldplate members are adapted to be joined together to form a manifold therebetween for receiving a fluid for use in cooling the electrical components. The secondary portion of each coldplate member is arranged substantially opposite the pocket of the other coldplate member when the coldplate members are joined together.

Coldplate with integrated electrical components for cooling thereof

A coldplate for use with electronic components in an electric vehicle (EV) or a hybrid-electric vehicle (HEV). The coldplate includes a main portion having multiple raised features on a surface thereof. The raised features are configured for attaching the main portion to a printed circuit board having multiple electronic components attached thereto. The raised features are further configured for maintaining the printed circuit board in a spaced relation relative to the main portion to facilitate air flow between the printed circuit board and the main portion for dissipating heat generated by the plurality of electronic components. The coldplate also includes a protrusion extending from the surface of the main portion. The protrusion is configured for contacting one of the plurality of electronic components attached to the printed circuit board for dissipating heat generated by the electronic component.

Coldplate for use in an electric vehicle (EV) or a hybrid-electric vehicle (HEV)

A coldplate for use with a transformer in an electric vehicle (EV) or a hybrid-electric vehicle (HEV). The coldplate includes a main portion having a recess formed therein, the recess having a floor configured for contacting a bottom surface of a transformer for dissipating heat generated by the transformer. The main portion includes a raised feature configured for contacting a winding of the transformer for dissipating heat generated by the transformer. The coldplate also includes a bracket member for use in securing the transformer in the recess of the main portion, the bracket member configured for contacting the main portion and the transformer for dissipating heat generated by the transformer. The bracket member includes a contact surface for contacting a top surface of the transformer, the contact surface having an area sufficient to contact substantially all of the top surface of the transformer.

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Farmington Hills, MI, United States of America

Venkat Rao Yalamanchili