Promerus, Lcc

Other

Sumitomo Bakelite Company Limited

Venkat R Dukkipati

Larry Funderburk Rhodes

Toshihiro Sato

Leah Langsdorf

Kei Kawasaki

Xianhe Wei

Embodiments in accordance with the present invention are directed to a method of fabricating a semiconductor device wherein a device wafer substrate is coated with a composition encompassing a surface energy modifier and a thermally stable polymer which is then bonded to a carrier wafer substrate coated with a composition encompassing a crosslinkable polymer composition. The polymer composition allows thinning of a device wafer before separating from the carrier wafer at room temperature.

Room temperature debondable and thermally curable compositions

Embodiments in accordance with the present invention provide for materials, methods for using such materials and structures that both incorporate such materials and are made using such methods that can be smoothly debonded at or near room temperature while providing a fixable bond that allows for wafer processing such as wafer thinning, anisotropic dry etching and chemical resistance during plating and etching.

Room temperature debonding composition, method and stack

Embodiments in accordance with the present invention are directed to poly(lactide) compositions that are useful for forming temporary bonding layers that serve to releasably join a first substrate to a second substrate as well as methods of both forming such a temporary bond and methods of debonding such substrates. Some such poly(lactide) compositions encompass a casting solvent, a photoacid generator and optionally a sensitizer and/or an adhesion promoter.

Polymer compositions for temporary bonding

Embodiments in accordance with the present invention are directed to polymer compositions that are useful for forming temporary bonding layers that serve to releasably join a first substrate to a second substrate as well as methods of both forming such a temporary bond and methods of debonding such substrates. Some such polymer compositions encompass a casting solvent, a photoacid generator and optionally a sensitizer and/or an adhesion promoter.

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Newport Beach, CA, United States of America

Venkat R Dukkipati