Qualcomm Incorporated

Qualcomm Technologies, Inc.

Snaptrack Incorporated

Veit Meister

Edgar Schmidhammer

Tomasz Jewula

Gerhard Zeller

In a component with component structures generating dissipation heat, it is proposed to apply on an active side of the substrate a heat-conducting means to the back side of the component substrate, which has a second thermal conductivity coefficient &#x3b1;, which is substantially higher than the first thermal conductivity coefficient &#x3b1;of the substrate. The heat dissipation then succeeds via the heat-conducting means and via connecting means which connect the substrate to a carrier.

Component with improved heat dissipation

A detector circuit can be used for determining the reflection coefficients of HF signals in a signal path. The detector circuit includes a bidirectional hybrid coupler, logarithmic amplifiers connected to the hybrid couple, and a subtractor having an offset connection.

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Unterhaching, Germany

Veit Meister